SCHEMBL20107457

SCHEMBL20107457

C=C(C)C(=O)OCCOC(=O)c1ccc2c(c1)COC2=O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PRF1 P14222 4/20 0.50
MAPT P10636 7/20 0.42
KDM4E B2RXH2 1/20 0.41
HSD17B10 Q99714 1/20 0.41
GAA P10253 2/20 0.40
LMNA P02545 2/20 0.40
NPC1 O15118 1/20 0.39
KCNJ1 P48048 1/20 0.39
KCNH2 Q12809 1/20 0.39
ALDH1A1 P00352 2/20 0.39
MAOA P21397 2/20 0.38
MAOB P27338 2/20 0.38
POLB P06746 1/20 0.38
APEX1 P27695 1/20 0.38
HTT P42858 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
ROCK2 O75116 1/20 0.37
RECQL P46063 1/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3029410 0.81 PRF1 (0.56) PRF1MAPTKDM4EGAALMNA
SCHEMBL3039890 0.81 PRF1 (0.70) PRF1MAPTKDM4EHSD17B10GAA
SCHEMBL1173800 0.80 ALDH1A1 (0.43) MAPTKDM4ELMNANPC1ALDH1A1
SCHEMBL29402768 0.80 ALDH1A1 (0.43) MAPTKDM4ELMNANPC1ALDH1A1
SCHEMBL3029409 0.76 MAPT (0.55) PRF1MAPTKDM4EHSD17B10GAA
SCHEMBL4812806 0.76 THRB (0.47) LMNAALDH1A1POLBAPEX1HTT
SCHEMBL1696749 0.76 TDP1 (0.54) MAPTHSD17B10LMNANPC1ALDH1A1
SCHEMBL28210901 0.75 PTGS2 (0.47) MAPTLMNANPC1ALDH1A1POLB
SCHEMBL10826399 0.75 HTT (0.41) MAPTKDM4EGAALMNAALDH1A1
SCHEMBL75194 0.75 MAPT (0.49) PRF1MAPTKDM4EHSD17B10GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3286606-B1 PHOTOSENSITIVE POLYIMIDE COMPOSITIONS FUJIFILM ELECTRONIC MAT USA INC (US) 2022-12-28 EP disclosed
WO-2018080870-A1 POLYIMIDES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2018-05-03 WO disclosed