Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CASP6 | P55212 | 1/20 | 0.60 |
| ▸ | TSHR | P16473 | 2/20 | 0.55 |
| ▸ | LMNA | P02545 | 1/20 | 0.55 |
| ▸ | POLB | P06746 | 1/20 | 0.54 |
| ▸ | HCAR3 | P49019 | 13/20 | 0.48 |
| ▸ | APEX1 | P27695 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15174048 | 0.84 | CASP6 (0.64) | CASP6TSHRLMNAPOLBHCAR3 | |
| SCHEMBL18027781 | 0.82 | CASP6 (0.66) | CASP6TSHRLMNAPOLBHCAR3 | |
| SCHEMBL1609806 | 0.82 | CASP6 (0.66) | CASP6TSHRLMNAPOLBHCAR3 | |
| SCHEMBL4101251 | 0.81 | CA2 (0.43) | CASP6TSHRLMNA | |
| Hydrochloric Acid SCHEMBL1609389 | 0.81 | CASP6 (0.64) | CASP6TSHRLMNAPOLBHCAR3 | |
| SCHEMBL10615900 | 0.81 | BACE1 (0.49) | CASP6 | |
| SCHEMBL7643058 | 0.81 | CASP6 (0.64) | CASP6TSHRLMNAPOLBHCAR3 | |
| SCHEMBL16481798 | 0.81 | CASP6 (0.55) | CASP6TSHRLMNAPOLBHCAR3 | |
| SCHEMBL23200508 | 0.79 | ATM (0.51) | LMNAPOLB | |
| SCHEMBL7712101 | 0.79 | CASP6 (0.62) | CASP6TSHRLMNAPOLBHCAR3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3964594-B1 | FLUX AND SOLDER PASTE | KOKI KK (JP) | 2024-04-17 | — | — | EP | disclosed |
| US-11806818-B2 | Flux and solder paste | KOKI COMPANY LIMITED (JP) | 2023-11-07 | — | — | US | disclosed |
| US-10933495-B2 | Solder paste containing solder powder and flux | KOKI COMPANY LIMITED (JP) | 2021-03-02 | — | — | US | disclosed |
| EP-3369522-A1 | FLUX AND SOLDER COMPOSITION | Koki Company Limited (JP) | 2018-09-05 | — | — | EP | disclosed |
| US-20180147675-A1 | Flux and Solder Composition | KOKI COMPANY LIMITED (JP) | 2018-05-31 | — | — | US | disclosed |
| CN-107614190-A | Scaling powder and solder composition | 株式会社弘辉 | 2018-01-19 | — | — | CN | disclosed |