SCHEMBL203349

SCHEMBL203349

CO[Si](CC1CO1)(OC)c1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.42
ALDH1A1 P00352 2/20 0.39
GLA P06280 1/20 0.39
CHRM2 P08172 10/20 0.37
CHRM3 P20309 9/20 0.37
CHRM4 P08173 8/20 0.37
CHRM1 P11229 8/20 0.37
MEN1 O00255 2/20 0.36
KMT2A Q03164 2/20 0.36
CHRM5 P08912 8/20 0.35
LMNA P02545 1/20 0.34
MGAM O43451 1/20 0.33
TP53 P04637 1/20 0.33
CYP3A4 P08684 1/20 0.33
TSHR P16473 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
HIF1A Q16665 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14562707 0.81 MGAM (0.35) TDP1ALDH1A1MGAM
SCHEMBL5265710 0.80 TDP1 (0.45) TDP1ALDH1A1GLAMEN1KMT2A
SCHEMBL15659687 0.79 MMP1 (0.33)
SCHEMBL9721065 0.78 TDP1 (0.42) TDP1ALDH1A1GLAMEN1KMT2A
SCHEMBL11290142 0.76 TSHR (0.46) TDP1ALDH1A1GLAMEN1KMT2A
SCHEMBL2018047 0.76 TSHR (0.46) TDP1ALDH1A1GLAMEN1KMT2A
SCHEMBL9560206 0.75 TSHR (0.49) TDP1ALDH1A1GLAMEN1KMT2A
SCHEMBL30605384 0.74 TDP1 (0.41) TDP1ALDH1A1GLACHRM2CHRM3
SCHEMBL10697835 0.74 ALDH1A1 (0.39) TDP1ALDH1A1GLACHRM2CHRM3
SCHEMBL14193863 0.72 TDP1 (0.47) TDP1ALDH1A1GLAMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2902441-B1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING CURED RESIN PRODUCT, AND METHOD FOR CAUSING SELF-POLYMERIZATION OF EPOXY COMPOUND MITSUBISHI CHEM CORP (JP) 2024-05-01 EP disclosed
EP-3173434-B1 THERMOSETTING RESIN COMPOSITION AND MOLDED BODY THEREOF MITSUBISHI CHEM CORP (JP) 2019-11-20 EP disclosed
EP-3173434-A1 THERMOSETTING RESIN COMPOSITION AND MOLDED BODY THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2017-05-31 EP disclosed
US-20170130006-A1 THERMOSETTING RESIN COMPOSITION AND MOLDED BODY THEREOF MITSUBISHI CHEMICAL CORPORATION (JP) 2017-05-11 US disclosed
US-9550877-B2 Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound MITSUBISHI CHEMICAL CORPORATION (JP) 2017-01-24 US disclosed
EP-2186844-B1 Heat-curable resin composition SHINETSU CHEMICAL CO (JP) 2016-08-03 EP disclosed
US-9359324-B2 Process for preparing episulfide compounds ASAHI KASEI CHEMICALS CORPORATION (JP) 2016-06-07 US disclosed
US-20150240070-A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING CURED RESIN PRODUCT, AND METHOD FOR CAUSING SELF-POLYMERIZATION OF EPOXY COMPOUND MITSUBISHI CHEMICAL CORPORATION (JP) 2015-08-27 US disclosed
EP-2902441-A1 THERMOSETTING RESIN COMPOSITION, METHOD FOR PRODUCING SAME, METHOD FOR PRODUCING CURED RESIN PRODUCT, AND METHOD FOR CAUSING SELF-POLYMERIZATION OF EPOXY COMPOUND Mitsubishi Chemical Corporation (JP) 2015-08-05 EP disclosed
US-20150197501-A1 Process for Preparing Episulfide Compounds ASAHI KASEI CHEMICALS CORPORATION (JP) 2015-07-16 US disclosed
WO-2006073055-A1 COMPOSITE SILICONE RUBBER POWDER, METHOD OF ITS MANUFACTURE, AND USE THEREOF DOW CORNING TORAY CO., LTD. (JP) 2006-07-13 WO disclosed
US-20050080204-A1 Silicone resin composition, curable resin composition, and curable resin DOW TORAY CO., LTD. (JP) 2005-04-14 US disclosed
EP-1478695-A1 SILICONE RESIN COMPOSITION, CURABLE RESIN COMPOSITION, AND CURED RESIN Dow Corning Toray Silicone Co., Ltd. (JP) 2004-11-24 EP disclosed
US-20040198925-A1 Curable epoxy resin composition DOW TORAY CO., LTD. (JP) 2004-10-07 US disclosed
EP-1408083-A1 CURABLE EPOXY RESIN COMPOSITION Dow Corning Toray Silicone Co., Ltd. (JP) 2004-04-14 EP disclosed
WO-2003072656-A1 SILICONE RESIN COMPOSITION, CURABLE RESIN COMPOSITION, AND CURED RESIN DOW CORNING TORAY SILICONE CO., LTD. (JP) 2003-09-04 WO disclosed
US-5952439-A A CURABLE RESIN BLENDS COMPRISING TRIFUNCTIONAL SILOXANE UNIT AND HAS A DISTINCT GLASS-TRANSITION TEMPERATURE IN THE RANGE OF-90.DEGREE. C. TO 150.DEGREE. C.; THE CURED MOLDING RESIN THAT IS FLEXIBLE, WATERPROOFING, RESISTANT TO HEAT SHOCK DOW CORNING TORAY SILICONE CO., LTD. (JP) 1999-09-14 US disclosed
EP-0620242-B1 Epoxy group-containing silicone resin and compositions based thereon DOW CORNING TORAY SILICONE (JP) 1998-08-19 EP disclosed
US-5516858-A CURABLE MOLDING MATERIALS DOW CORNING TORAY SILICONE CO., LTD. (JP) 1996-05-14 US disclosed
EP-0620242-A2 Epoxy group-containing silicone resin and compositions based thereon Dow Corning Toray Silicone Company, Limited (JP) 1994-10-19 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20150197501-A1 Process for Preparing Episulfide Compounds TST, EPHX2, STS TDP1 3346/4885ALDH1A1 405/4885GLA 4177/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.