Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CUL4A | Q13619 | 1/20 | 0.64 |
| ▸ | KDM4E | B2RXH2 | 5/20 | 0.58 |
| ▸ | KMT2A | Q03164 | 5/20 | 0.56 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.56 |
| ▸ | MAPT | P10636 | 3/20 | 0.56 |
| ▸ | ADORA3 | P0DMS8 | 3/20 | 0.56 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.56 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.56 |
| ▸ | ABCC4 | O15439 | 2/20 | 0.56 |
| ▸ | CACNA1F | O60840 | 2/20 | 0.56 |
| ▸ | ABCB11 | O95342 | 2/20 | 0.56 |
| ▸ | LMNA | P02545 | 2/20 | 0.56 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.56 |
| ▸ | ADORA2A | P29274 | 2/20 | 0.56 |
| ▸ | ADORA1 | P30542 | 2/20 | 0.56 |
| ▸ | OPRM1 | P35372 | 2/20 | 0.56 |
| ▸ | SCN1A | P35498 | 2/20 | 0.56 |
| ▸ | HTR2B | P41595 | 2/20 | 0.56 |
| ▸ | CACNA1D | Q01668 | 2/20 | 0.56 |
| ▸ | KCNH2 | Q12809 | 2/20 | 0.56 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7265869 | 0.89 | KDM4E (0.58) | CUL4AKDM4EKMT2AALDH1A1MAPT | |
| SCHEMBL10693916 | 0.86 | ADORA3 (0.78) | CUL4AKDM4EKMT2AALDH1A1MAPT | |
| SCHEMBL3037209 | 0.82 | KMT2A (0.50) | CUL4AKDM4EKMT2AALDH1A1MAPT | |
| SCHEMBL11307558 | 0.82 | ADORA3 (0.62) | CUL4AKDM4EKMT2AALDH1A1MAPT | |
| SCHEMBL9765784 | 0.81 | MAPT (0.57) | CUL4AKDM4EKMT2AALDH1A1MAPT | |
| SCHEMBL13198586 | 0.80 | CACNA1C (0.63) | CUL4AKDM4EKMT2AALDH1A1MAPT | |
| SCHEMBL15571755 | 0.78 | CUL4A (1.00) | CUL4AKDM4EKMT2AALDH1A1MAPT | |
| SCHEMBL11357785 | 0.78 | KDM4E (0.47) | CUL4AKDM4EKMT2AALDH1A1MAPT | |
| SCHEMBL3326305 | 0.78 | ALDH1A1 (0.52) | CUL4AKDM4EKMT2AALDH1A1MAPT | |
| SCHEMBL12727534 | 0.75 | CACNA1C (0.58) | CUL4AKDM4EKMT2AALDH1A1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0578177-B1 | Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern | NITTO DENKO CORP (JP) | 1997-03-05 | — | — | EP | claimed |
| EP-0578177-A2 | Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern | NITTO DENKO CORPORATION (JP) | 1994-01-12 | — | — | EP | claimed |
| US-8778596-B2 | Photosensitive resin composition, pattern forming material comprising the photosensitive resin composition, and pattern forming method and article using the photosensitive resin composition | DAI NIPPON PRINTING CO., LTD. (JP) | 2014-07-15 | — | — | US | disclosed |
| US-8742059-B2 | Polymer precursor, high transparency polyimide precursor, polymer compound, resin composition and article using thereof | DAI NIPPON PRINTING CO., LTD. (JP) | 2014-06-03 | — | — | US | disclosed |
| US-8697332-B2 | Base generator, photosensitive resin composition, pattern forming material comprising the photosensitive resin composition, pattern forming method using the photosensitive resin composition and products comprising the same | DAI NIPPON PRINTING CO., LTD. (JP) | 2014-04-15 | — | — | US | disclosed |
| US-20130309607-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION | DAI NIPPON PRINTING CO., LTD. (JP) | 2013-11-21 | — | — | US | disclosed |
| US-8476444-B2 | Base generator | DAI NIPPON PRINTING CO., LTD. (JP) | 2013-07-02 | — | — | US | disclosed |
| US-20120183751-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME | DAI NIPPON PRINTING CO., LTD. (JP) | 2012-07-19 | — | — | US | disclosed |
| US-20120122033-A1 | POLYMER PRECURSOR, HIGH TRANSPARENCY POLYIMIDE PRECURSOR, POLYMER COMPOUND, RESIN COMPOSITION AND ARTICLE USING THEREOF | DAI NIPPON PRINTING CO., LTD. (JP) | 2012-05-17 | — | — | US | disclosed |
| US-20120070781-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME | DAI NIPPON PRINTING CO., LTD. (JP) | 2012-03-22 | — | — | US | disclosed |
| US-8088882-B2 | Polymer precursor, high transparency polyimide precursor, polymer compound, resin composition and article using thereof | DAI NIPPON PRINTING CO., LTD. (JP) | 2012-01-03 | — | — | US | disclosed |
| EP-0271851-B1 | LIGHT SENSITIVE MIXTURES FOR MAKING REPEATEDLY TONABLE LAYERS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1993-03-10 | — | — | EP | disclosed |
| US-4904555-A | Photosensitive composition for making repeatably tonable layers | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1990-02-27 | — | — | US | disclosed |
| US-4859551-A | Process for preparing positive and negative images using photohardenable electrostatic master | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1989-08-22 | — | — | US | disclosed |
| EP-0315121-A2 | Process for preparing positive and negative images using photohardenable electrostatic master | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1989-05-10 | — | — | EP | disclosed |
| EP-0171748-B1 | NEGATIVE-TONING IMAGING SYSTEM WITH RE-IMAGING CAPABILITY USING 4-(2'-NITROPHENYL)-1,4-DIHYDROPYRIDINE COMPOUNDS | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1988-06-08 | — | — | EP | disclosed |
| US-4604340-A | TACKY AND TONABLE WITH ACTINIC RADIATION | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1986-08-05 | — | — | US | disclosed |
| EP-0171748-A2 | Negative-toning imaging system with re-imaging capability using 4-(2'-nitrophenyl)-1,4-Dihydropyridine compounds | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 1986-02-19 | — | — | EP | disclosed |
| US-4269933-A | PHOTOLITHOGRAPHY; POSITIVE AND NEGATIVE IMAGES; POLYMERIZATION OF A UNSATURATED POLYESTER USING A PHOTOSENSITIVE FREE RADICAL SYSTEM | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1981-05-26 | — | — | US | disclosed |
| US-4198242-A | Photopolymerizable composition containing an o-nitroaromatic compound as photoinhibitor | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 1980-04-15 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20120070781-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME | RER1, SUN2, REV1 | CUL4A 2934/4885KDM4E 2434/4885KMT2A 1400/4885 |
| US-20120183751-A1 | BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME | RER1, SUN2, POLR1G | CUL4A 3159/4885KDM4E 1949/4885KMT2A 1328/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.