Predicted protein targets (top 14)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA2 | P00918 | 16/20 | 0.37 |
| ▸ | CA1 | P00915 | 15/20 | 0.37 |
| ▸ | MMP1 | P03956 | 4/20 | 0.34 |
| ▸ | MMP2 | P08253 | 4/20 | 0.34 |
| ▸ | MMP9 | P14780 | 4/20 | 0.34 |
| ▸ | MMP8 | P22894 | 4/20 | 0.34 |
| ▸ | MMP13 | P45452 | 4/20 | 0.34 |
| ▸ | F2 | P00734 | 2/20 | 0.33 |
| ▸ | PRSS1 | P07477 | 2/20 | 0.33 |
| ▸ | PRSS2 | P07478 | 2/20 | 0.33 |
| ▸ | PRSS3 | P35030 | 2/20 | 0.33 |
| ▸ | PIK3CD | O00329 | 1/20 | 0.30 |
| ▸ | PIK3CA | P42336 | 1/20 | 0.30 |
| ▸ | PIK3CB | P42338 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL444424 | 0.82 | CA2 (0.40) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL59304 | 0.82 | CA2 (0.40) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL51423 | 0.80 | CA2 (0.39) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL1800748 | 0.79 | CA1 (0.34) | CA2CA1PIK3CDPIK3CAPIK3CB | |
| SCHEMBL1804139 | 0.77 | GAA (0.35) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL3284035 | 0.76 | CA2 (0.36) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL1869148 | 0.75 | CA1 (0.36) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL9421923 | 0.74 | CA1 (0.36) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL1805423 | 0.74 | CA1 (0.35) | CA2CA1MMP1MMP2MMP9 | |
| SCHEMBL9106447 | 0.72 | MCL1 (0.36) | CA2CA1PIK3CDPIK3CAPIK3CB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9535326-B2 | Methods of manufacturing a semiconductor device | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2017-01-03 | — | — | US | disclosed |
| US-20150227046-A1 | METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2015-08-13 | — | — | US | disclosed |
| US-7968275-B2 | Method of forming a pattern using a photoresist composition for immersion lithography | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2011-06-28 | — | — | US | disclosed |
| US-7781153-B2 | Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-08-24 | — | — | US | disclosed |
| US-7670748-B2 | Cyclic compound, photoresist composition and method of forming a photoresist pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2010-03-02 | — | — | US | disclosed |
| US-20090176177-A1 | METHOD OF FORMING A PATTERN USING A PHOTORESIST COMPOSITION FOR IMMERSION LITHOGRAPHY | SAMSUNG ELECTRONICS CO., LTD. | 2009-07-09 | — | — | US | disclosed |
| US-20090092931-A1 | Methods of forming a blocking pattern using a photosensitive composition and methods of manufacturing a semiconductor device | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2009-04-09 | — | — | US | disclosed |
| US-7494761-B2 | Cyclodextrin derivative, photoresist composition including the cyclodextrin derivative and method of forming a pattern using the photoresist composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2009-02-24 | — | — | US | disclosed |
| US-7485407-B2 | Siloxane compound, photoresist composition including the siloxane compound and method of forming a pattern using the photoresist composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2009-02-03 | — | — | US | disclosed |
| US-7442489-B2 | Photoresist composition and method of forming a photoresist pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2008-10-28 | — | — | US | disclosed |
| US-20070249117-A1 | Polymer resin composition, related method for forming a pattern, and related method for fabricating a capacitor | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-10-25 | — | — | US | disclosed |
| US-7258963-B2 | Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern by using the photoresist composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-08-21 | — | — | US | disclosed |
| US-20070166644-A1 | Photoresist composition and method of forming a photoresist pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-07-19 | — | — | US | disclosed |
| US-20070148590-A1 | Siloxane compound, photoresist composition including the siloxane compound and method of forming a pattern using the photoresist composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-06-28 | — | — | US | disclosed |
| US-20070141511-A1 | Cyclic compound, photoresist composition and method of forming a photoresist pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-06-21 | — | — | US | disclosed |
| US-20060188821-A1 | Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern using the photoresist composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-08-24 | — | — | US | disclosed |
| US-20060160019-A1 | Photosensitive resin, photoresist composition having the photosensitive resin and method of forming a photoresist pattern by using the photoresist composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-07-20 | — | — | US | disclosed |
| US-20060160021-A1 | Photoresist composition and method of forming a photoresist pattern using the same | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-07-20 | — | — | US | disclosed |
| US-20060160020-A1 | Photosensitive polymer, photoresist composition having the photosensitive polymer and method of forming a photoresist pattern using the photoresist composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-07-20 | — | — | US | disclosed |
| US-20060134549-A1 | Photosensitive polymer, photoresist composition including the photosensitive polymer and method of forming a photoresist pattern using the photoresist composition | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2006-06-22 | — | — | US | disclosed |