SCHEMBL2077879

SCHEMBL2077879

CC1(C)C2CC1(C)C(C)(C(=O)OC(=O)C1(C)C(C(=O)O)C3CC1(C)C3(C)C)C2C(=O)O

nearest known ligand 0.32

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
APLNR P35414 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7182078 0.65 HTT (0.30)
SCHEMBL1596589 0.58 APLNR (0.37) APLNR
SCHEMBL1596160 0.57 APLNR (0.32) APLNR
SCHEMBL911204 0.57 MAPK1 (0.44) APLNR
SCHEMBL911206 0.57 MAPK1 (0.44) APLNR
SCHEMBL350106 0.57 MAPK1 (0.44) APLNR
SCHEMBL10614719 0.56 APLNR (0.39) APLNR
SCHEMBL426067 0.56 ALDH1A1 (0.47) APLNR
SCHEMBL8537146 0.56 MAPK1 (0.35)
SCHEMBL3494225 0.56 MAPK1 (0.77)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024062865-A1 2-CYANOACRYLATE ADHESIVE COMPOSITION 田岡化学工業株式会社 2024-03-28 WO claimed
CN-112592666-B 360-DEG C-resistant high-temperature epoxy adhesive and preparation method and application thereof 康达新材料(集团)股份有限公司 2022-11-25 CN claimed
CN-112592666-A 360-DEG C-resistant high-temperature epoxy adhesive and preparation method and application thereof 上海康达化工新材料集团股份有限公司 2021-04-02 CN claimed
WO-2024062865-A1 2-CYANOACRYLATE ADHESIVE COMPOSITION 田岡化学工業株式会社 2024-03-28 WO disclosed
CN-112592666-B 360-DEG C-resistant high-temperature epoxy adhesive and preparation method and application thereof 康达新材料(集团)股份有限公司 2022-11-25 CN disclosed
US-11077405-B2 Module for gas separation, and gas separation method ASAHI KASEI KABUSHIKI KAISHA (JP) 2021-08-03 US disclosed
CN-112592666-A 360-DEG C-resistant high-temperature epoxy adhesive and preparation method and application thereof 上海康达化工新材料集团股份有限公司 2021-04-02 CN disclosed
US-20190193022-A1 Gas Separation Membrane ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-06-27 US disclosed
US-20190076786-A1 Module for Gas Separation, and Gas Separation Method ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-03-14 US disclosed
EP-2028183-B1 NOVEL EPOXY COMPOUND AND METHOD FOR PRODUCING THE SAME SHOWA DENKO KK (JP) 2014-03-26 EP disclosed
US-7863461-B2 Epoxy compounds and method for production of the same SHOWA DENKO K.K. (JP) 2011-01-04 US disclosed
US-20090253915-A1 NOVEL EPOXY COMPOUNDS AND METHOD FOR PRODUCTION OF THE SAME SHOWA DENKO K.K. (JP) 2009-10-08 US disclosed
EP-2028183-A1 NOVEL EPOXY COMPOUND AND METHOD FOR PRODUCING THE SAME Showa Denko K.K. (JP) 2009-02-25 EP disclosed
US-20060040202-A1 Positive working photosensitive composition SUMITOMO CHEMICAL COMPANY, LIMITED 2006-02-23 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20090253915-A1 NOVEL EPOXY COMPOUNDS AND METHOD FOR PRODUCTION OF THE SAME PTGIS, PTGES, CYP2E1 APLNR 4499/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.