Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 11/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 4/20 | 0.47 |
| ▸ | MAPT | P10636 | 3/20 | 0.47 |
| ▸ | MEN1 | O00255 | 2/20 | 0.47 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.47 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.47 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.47 |
| ▸ | APP | P05067 | 7/20 | 0.46 |
| ▸ | HPGD | P15428 | 4/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.46 |
| ▸ | CASP3 | P42574 | 1/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.41 |
| ▸ | PKM | P14618 | 1/20 | 0.41 |
| ▸ | POLB | P06746 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.37 |
| ▸ | APAF1 | O14727 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18655707 | 0.79 | ALDH1A1 (0.49) | ALDH1A1HSD17B10MAPTMEN1KMT2A | |
| SCHEMBL21028371 | 0.77 | APP (0.53) | ALDH1A1HSD17B10MAPTMEN1KMT2A | |
| SCHEMBL28083799 | 0.73 | CASP3 (0.57) | ALDH1A1HSD17B10MAPTMEN1KMT2A | |
| SCHEMBL10053401 | 0.73 | ALDH1A1 (0.59) | ALDH1A1HSD17B10MAPTMEN1KMT2A | |
| SCHEMBL11519236 | 0.72 | PPOX (0.50) | ALDH1A1MAPTCASP3KDM4E | |
| SCHEMBL21558556 | 0.72 | MPO (0.44) | ALDH1A1HSD17B10MEN1KMT2AHPGD | |
| SCHEMBL28250613 | 0.72 | KMT2A (0.58) | ALDH1A1MAPTMEN1KMT2AHPGD | |
| SCHEMBL20456055 | 0.72 | GABRA1 (0.44) | ALDH1A1MAPTMEN1KMT2APKM | |
| SCHEMBL2616778 | 0.71 | APP (0.67) | ALDH1A1HSD17B10MAPTMEN1KMT2A | |
| SCHEMBL24191851 | 0.71 | MEN1 (0.53) | ALDH1A1HSD17B10MAPTMEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10941320-B2 | Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion | TORAY INDUSTRIES, INC. (JP) | 2021-03-09 | — | — | US | disclosed |
| US-20190080952-A1 | ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSTION | TORAY INDUSTRIES, INC. (JP) | 2019-03-14 | — | — | US | disclosed |