SCHEMBL21044938

CCCCCC(C)(CC)C(=O)N(CC1CCCCC1)c1ccc(F)c([Ti](c2c(F)ccc(N(CC3CCCCC3)C(=O)C(C)(CC)CCCCC)c2F)(C2C=CC=C2)C2C=CC=C2)c1F

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compound	similarity	top predicted	shared targets
SCHEMBL23854472	0.94	HDAC3 (0.30)	—
SCHEMBL29480004	0.86	HDAC3 (0.31)	—
SCHEMBL483133	0.84	—	—
SCHEMBL20164067	0.82	PDK1 (0.30)	—
SCHEMBL20164078	0.81	ALDH1A1 (0.33)	—
SCHEMBL23854471	0.78	—	—
SCHEMBL29480009	0.76	RIPK1 (0.36)	—
SCHEMBL29480059	0.76	PDK1 (0.37)	—
SCHEMBL21044975	0.76	ALDH1A1 (0.33)	—
SCHEMBL29479971	0.76	HDAC1 (0.38)	—

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

Patent	Title	Assignee	Published	Priority	Filing	Country	Status
CN-113383273-B	Photosensitive resin composition, pattern forming method, cured film, laminate, and device	富士胶片株式会社	2023-11-14	—	—	CN	disclosed
CN-114402256-A	Organic film, method for producing same, composition, laminate, and semiconductor device	富士胶片株式会社	2022-04-26	—	—	CN	disclosed
EP-3492982-B1	PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE	FUJIFILM CORP (JP)	2020-11-11	—	—	EP	disclosed
EP-3492982-A1	PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE	FUJIFILM Corporation (JP)	2019-06-05	—	—	EP	disclosed