SCHEMBL21189414

SCHEMBL21189414

CC(c1ccc(C2CCCCC2)cc1)(c1ccccc1S)c1ccccc1S

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KIF11 P52732 1/20 0.40
CYP3A4 P08684 1/20 0.37
CYP2C9 P11712 1/20 0.37
ACE P12821 1/20 0.36
HTR2C P28335 2/20 0.35
LMNA P02545 3/20 0.35
HTT P42858 2/20 0.35
CNR2 P34972 4/20 0.35
SLC18A3 Q16572 1/20 0.34
HDAC1 Q13547 1/20 0.34
HDAC8 Q9BY41 1/20 0.34
HDAC6 Q9UBN7 1/20 0.34
MAPT P10636 2/20 0.34
SMN1; SMN2 Q16637 2/20 0.34
ALDH1A1 P00352 1/20 0.34
TP53 P04637 1/20 0.34
ATM Q13315 1/20 0.34
XBP1 P17861 1/20 0.34
PTGES2 Q9H7Z7 1/20 0.34
S1PR1 P21453 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21189420 0.82 CYP3A4 (0.38) KIF11CYP3A4CYP2C9ACEHTR2C
SCHEMBL22991406 0.80 KIF11 (0.33) KIF11
SCHEMBL21189661 0.80 ESR1 (0.41) KIF11CYP3A4ALDH1A1
SCHEMBL21189675 0.79 CYP3A4 (0.39) KIF11CYP3A4CYP2C9ACEHTR2C
SCHEMBL21189421 0.79 CYP3A4 (0.41) KIF11CYP3A4CYP2C9ACEHTR2C
SCHEMBL21189676 0.78 CYP3A4 (0.40) CYP3A4CYP2C9ACEHTR2CLMNA
SCHEMBL21189651 0.74 ESR1 (0.45) CYP3A4MAPTALDH1A1
SCHEMBL6902989 0.73 SLC6A2 (0.49) CYP3A4CYP2C9HTR2CLMNAHTT
SCHEMBL4329015 0.73 SLC6A2 (0.49) CYP3A4CYP2C9HTR2CLMNAHTT
SCHEMBL23082023 0.72 DEGS1 (0.53) CYP3A4CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3744710-A1 COMPOUND, RESIN, COMPOSITION, AND PATTERN FORMING METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-12-02 EP disclosed
WO-2019142897-A1 COMPOUND, RESIN, COMPOSITION, AND PATTERN FORMING METHOD 三菱瓦斯化学株式会社 2019-07-25 WO disclosed