SCHEMBL21189421

SCHEMBL21189421

CC(c1ccc(S)cc1)(c1ccc(S)cc1)c1ccc(C2CCCCC2)cc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 1/20 0.41
CYP2C9 P11712 1/20 0.41
LMNA P02545 2/20 0.39
HTT P42858 1/20 0.39
CNR2 P34972 6/20 0.39
HDAC8 Q9BY41 2/20 0.39
HDAC6 Q9UBN7 2/20 0.39
HDAC1 Q13547 1/20 0.39
MAPT P10636 2/20 0.38
ALDH1A1 P00352 1/20 0.38
TP53 P04637 1/20 0.38
ATM Q13315 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
ACE P12821 1/20 0.37
HTR2C P28335 2/20 0.36
KCNH2 Q12809 1/20 0.36
HRH3 Q9Y5N1 1/20 0.36
HDAC3 O15379 1/20 0.36
HDAC11 Q96DB2 1/20 0.36
DEGS1 O15121 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL879500 0.84 HTT (0.44) LMNAHTTHDAC8HDAC6HDAC1
SCHEMBL21189420 0.83 CYP3A4 (0.38) CYP3A4CYP2C9LMNAHTTCNR2
SCHEMBL6348093 0.82 HDAC1 (0.45) CYP3A4CYP2C9LMNAHTTHDAC8
SCHEMBL23082023 0.82 DEGS1 (0.53) CYP3A4CYP2C9DEGS1
SCHEMBL21189676 0.82 CYP3A4 (0.40) CYP3A4CYP2C9LMNAHTTCNR2
SCHEMBL21189414 0.79 KIF11 (0.40) CYP3A4CYP2C9LMNAHTTCNR2
SCHEMBL4329015 0.79 SLC6A2 (0.49) CYP3A4CYP2C9LMNAHTTCNR2
SCHEMBL6902989 0.79 SLC6A2 (0.49) CYP3A4CYP2C9LMNAHTTCNR2
SCHEMBL21189675 0.77 CYP3A4 (0.39) CYP3A4CYP2C9LMNAHTTCNR2
SCHEMBL5146562 0.77 SLC6A2 (0.46) CYP3A4CYP2C9LMNACNR2HDAC8

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3744710-A1 COMPOUND, RESIN, COMPOSITION, AND PATTERN FORMING METHOD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2020-12-02 EP disclosed
WO-2019142897-A1 COMPOUND, RESIN, COMPOSITION, AND PATTERN FORMING METHOD 三菱瓦斯化学株式会社 2019-07-25 WO disclosed