SCHEMBL2139228

SCHEMBL2139228

CCO[SiH](OCC)C(=O)CC

nearest known ligand 0.38

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
SOAT1 P35610 1/20 0.38
ALDH1A1 P00352 4/20 0.35
TDP1 Q9NUW8 2/20 0.33
FFAR3 O14843 1/20 0.33
LMNA P02545 1/20 0.33
HSD17B10 Q99714 1/20 0.33
ALOX15 P16050 1/20 0.32
MGAM O43451 1/20 0.32
GAA P10253 1/20 0.32
SI P14410 1/20 0.32
MGAM2 Q2M2H8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22436615 0.67 THRB (0.38) ALDH1A1TDP1LMNAHSD17B10MGAM
SCHEMBL28618492 0.67 ALDH1A1 (0.31) ALDH1A1
SCHEMBL1270674 0.67
SCHEMBL31604368 0.65 HCAR2 (0.31)
SCHEMBL3948920 0.65
Acetone SCHEMBL28132690 0.65 ALDH1A1 (0.43) SOAT1ALDH1A1TDP1FFAR3LMNA
SCHEMBL10637930 0.63 ALDH1A1 (0.41) SOAT1ALDH1A1TDP1FFAR3
SCHEMBL63317 0.63
Urea SCHEMBL9068018 0.63 ALOX15 (0.46) SOAT1ALDH1A1TDP1LMNAHSD17B10
Acetic Acid SCHEMBL2248274 0.63 FFAR3 (0.41) SOAT1ALDH1A1TDP1FFAR3LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7863374-B2 Self-curable water-based solid adhesive and bonding method using the self-curable water-based solid adhesive KONISHI CO., LTD. (JP) 2011-01-04 US disclosed
US-20080119607-A1 Self-curable water-based solid adhesive and bonding method using the self-curable water-based solid adhesive SHIBAHARA SYUNSUKE 2008-05-22 US disclosed
US-7084203-B2 Self-reactive/curable water-based solid adhesive and method of bonding with the self-reactive/curable water-based solid adhesive KONISHI CO., LTD. (JP) 2006-08-01 US disclosed
US-20040132864-A1 Self-reactive/curable water-based solid adhesive and method of bonding with the self-reactive/curable water-based solid adhesive KONISHI CO., LTD. (JP) 2004-07-08 US disclosed
EP-1431366-A1 SELF−REACTIVE/CURABLE WATER−BASED SOLID ADHESIVE AND METHOD OF BONDING WITH THE SELF−REACTIVE/CURABLE WATER−BASED SOLID ADHESIVE KONISHI CO., LTD. (JP) 2004-06-23 EP disclosed