SCHEMBL2160231

SCHEMBL2160231

CCCc1nnc(CCC)n1N

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.48
HPGD P15428 3/20 0.44
HSD17B10 Q99714 2/20 0.44
TSHR P16473 2/20 0.44
KMT2A Q03164 1/20 0.44
HTT P42858 3/20 0.42
L3MBTL1 Q9Y468 1/20 0.36
TDP1 Q9NUW8 1/20 0.36
HSD11B1 P28845 1/20 0.35
GAA P10253 1/20 0.35
RAB9A P51151 1/20 0.35
LMNA P02545 2/20 0.34
ALOX15 P16050 1/20 0.33
TLR8 Q9NR97 1/20 0.31
GRIN2D O15399 1/20 0.30
GRIN3B O60391 1/20 0.30
GRIA1 P42261 1/20 0.30
GRIA2 P42262 1/20 0.30
GRIA3 P42263 1/20 0.30
GRIA4 P48058 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2952162 0.85 ALDH1A1 (0.43) ALDH1A1HPGDHSD17B10TSHRKMT2A
SCHEMBL5924317 0.84 ALDH1A1 (0.66) ALDH1A1HPGDHSD17B10TSHRKMT2A
SCHEMBL5924299 0.80 ALDH1A1 (0.56) ALDH1A1HPGDTSHRLMNA
SCHEMBL4629067 0.77 GAA (0.39) ALDH1A1HPGDHSD17B10L3MBTL1TDP1
SCHEMBL4943687 0.75
SCHEMBL18529420 0.74 HSD11B1 (0.41) ALDH1A1HPGDHSD17B10TSHRKMT2A
SCHEMBL13771914 0.72 ALDH1A1 (0.58) ALDH1A1HPGDHSD17B10TSHRKMT2A
SCHEMBL4405692 0.72
SCHEMBL5914403 0.71 ALDH1A1 (0.56) ALDH1A1HPGDHSD17B10TSHRKMT2A
SCHEMBL10012951 0.71 ALDH1A1 (0.56) ALDH1A1HPGDHSD17B10TSHRKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 93 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9486892-B2 Polishing composition FUJIMI INCORPORATED (JP) 2016-11-08 US claimed
US-12601970-B2 Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component HD MICROSYSTEMS, LTD. (JP) 2026-04-14 US disclosed
US-20250189895-A1 METHOD OF MANUFACTURING PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-12 US disclosed
WO-2025105122-A1 METHOD FOR MANUFACTURING MODIFIED SUBSTRATE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND KIT 富士フイルム株式会社 2025-05-22 WO disclosed
US-11992914-B2 Polishing composition, polishing method, and method for producing substrate FUJIMI INCORPORATED (JP) 2024-05-28 US disclosed
CN-114207038-B Resin composition, method for producing cured product, pattern cured product, interlayer insulating film, covercoat, surface protective film, and electronic component 艾曲迪微系统股份有限公司 2024-03-22 CN disclosed
WO-2023195202-A1 HYBRID BONDING INSULATION FILM-FORMING MATERIAL, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE HDマイクロシステムズ株式会社 2023-10-12 WO disclosed
WO-2023162551-A1 METHOD FOR PRODUCING PLATED SHAPED ARTICLE 東京応化工業株式会社 2023-08-31 WO disclosed
US-20220291584-A1 Resin Composition, Method for Manufacturing Cured Product, Cured Product, Patterned Cured Product, Interlayer Insulation Film, Cover Coating Layer, Surface Protection Film, and Electronic Component HD MICROSYSTEMS, LTD. (JP) 2022-09-15 US disclosed
US-11421132-B2 Polishing composition FUJIMI INCORPORATED 2022-08-23 US disclosed
EP-2605270-A1 POLISHING COMPOSITION AND POLISHING METHOD Fujimi Incorporated (JP) 2013-06-19 EP disclosed
CN-103154168-A Polishing composition and polishing method FUJIMI INC 2013-06-12 CN disclosed
US-20110250754-A1 Polishing Composition and Polishing Method FIJIMI INCORPORATED (JP) 2011-10-13 US disclosed
EP-2374852-A1 Polishing composition and polishing method FUJIMI INCORPORATED (JP) 2011-10-12 EP disclosed
US-20110180511-A1 Polishing Composition and Polishing Method Using the Same FUJIMI INCORPORATED (JP) 2011-07-28 US disclosed
EP-2348080-A1 Polishing composition and polishing method using the same FUJIMI INCORPORATED (JP) 2011-07-27 EP disclosed
US-20060089316-A1 Method for reducing a susceptibility to tumor formation induced by 3-deoxyglucosone and precursors thereof BROWN TRUMAN R 2006-04-27 US disclosed
US-5318982-A Inhibiting crosslinking of proteins THE ROCKEFELLER UNIVERSITY (US) 1994-06-07 US disclosed
EP-0269308-B1 PROCESS FOR THE SYNTHESIS OF 4-AMINO-1,2,4-(4H)TRIAZOLE DERIVATIVES REILLY INDUSTRIES, INC. (US) 1993-03-17 EP disclosed
EP-0269308-A2 Process for the synthesis of 4-amino-1,2,4-(4H)triazole derivatives REILLY INDUSTRIES, INC. (US) 1988-06-01 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12601970-B2 Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component ARCN1, P4HA1, COL1A1 ALDH1A1 382/4885HPGD 1833/4885HSD17B10 625/4885
US-20060089316-A1 Method for reducing a susceptibility to tumor formation induced by 3-deoxyglucosone and precursors thereof ALDOA, FBP1, GYS2 ALDH1A1 450/4885HPGD 20/4885HSD17B10 266/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.