SCHEMBL216846

SCHEMBL216846

C=CC(=O)OC1C2CC3CC(C2)CC1(CC(CC)OC)C3

nearest known ligand 0.32

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.32
KMT2A Q03164 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL451377 0.85 ALDH1A1 (0.31) ALDH1A1KMT2ASMN1; SMN2
SCHEMBL214611 0.83 ALDH1A1 (0.32) ALDH1A1KMT2ASMN1; SMN2
SCHEMBL21247654 0.80 MEN1 (0.33) ALDH1A1KMT2A
SCHEMBL27760574 0.78 TSHR (0.36) ALDH1A1KMT2A
SCHEMBL12346677 0.73 ALDH1A1 (0.35) ALDH1A1SMN1; SMN2
SCHEMBL284285 0.72
SCHEMBL19619432 0.71
SCHEMBL454651 0.70 THRB (0.30) ALDH1A1SMN1; SMN2
SCHEMBL5917727 0.69 ATM (0.44) ALDH1A1SMN1; SMN2
SCHEMBL7036978 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250189896-A1 RESIST UNDERLAYER FILM FORMATION COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2025-06-12 US disclosed
US-20250136734-A1 PROTECTIVE-FILM FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2025-05-01 US disclosed
CN-118786391-A Composition for forming resist underlayer film 日产化学株式会社 2024-10-15 CN disclosed
CN-118742856-A Composition for forming protective film 日产化学株式会社 2024-10-01 CN disclosed
WO-2023162653-A1 RESIST UNDERLAYER FILM FORMATION COMPOSITION 日産化学株式会社 2023-08-31 WO disclosed
WO-2023157772-A1 PROTECTIVE FILM FORMING COMPOSITION 日産化学株式会社 2023-08-24 WO disclosed
US-11592747-B2 Resist underlayer film-forming composition comprising carbonyl-containing polyhydroxy aromatic ring novolac resin NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2023-02-28 US disclosed
US-11199777-B2 Resist underlayer film-forming composition containing novolac polymer having secondary amino group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2021-12-14 US disclosed
CN-104412163-B Method for manufacturing semiconductor device using composition for forming organic underlayer film for solvent development lithography process 日产化学工业株式会社 2020-05-22 CN disclosed
CN-105874386-B Resist underlayer film-forming composition containing novolac polymer having secondary amino group 日产化学工业株式会社 2019-12-06 CN disclosed
US-20070238029-A1 Underlayer Coating Forming Composition for Lithography Containing Naphthalene Ring Having Halogen Atom NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2007-10-11 US disclosed
US-7226721-B2 Underlayer coating forming composition for lithography containing compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2007-06-05 US disclosed
EP-1780600-A1 LOWER LAYER FILM FORMING COMPOSITION FOR LITHOGRAPHY INCLUDING NAPHTHALENE RING HAVING HALOGEN ATOM Nissan Chemical Industries, Ltd. (JP) 2007-05-02 EP disclosed
US-20060234156-A1 Composition for formation of underlayer film for lithography containing epoxy compound and carboxylic acid compound NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-10-19 US disclosed
US-20060210915-A1 Composition for forming lower layer film for lithography comprising compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-09-21 US disclosed
EP-1662769-A1 COMPOSITION FOR FORMING LOWER LAYER FILM FOR LITHOGRAPHY COMPRISING COMPOUND HAVING PROTECTED CARBOXYL GROUP Nissan Chemical Industries, Ltd. (JP) 2006-05-31 EP disclosed
EP-1617289-A1 COMPOSITION FOR FORMATION OF UNDERLAYER FILM FOR LITHOGRAPHY CONTAINING EPOXY COMPOUND AND CARBOXYLIC ACID COMPOUND Nissan Chemical Industries, Ltd. (JP) 2006-01-18 EP disclosed
US-6824956-B2 ADDITION POLYMER CONTAINING UNITS OF AN ADAMANTYL ESTER HAVING HYDROXY GROUPS FUJI PHOTO FILM CO., LTD. (JP) 2004-11-30 US disclosed
US-20030194640-A1 Positive resist composition FUJI PHOTO FILM CO., LTD. 2003-10-16 US disclosed
EP-1338922-A2 Positive resist composition FUJI PHOTO FILM CO., LTD. (JP) 2003-08-27 EP disclosed