SCHEMBL2174989

SCHEMBL2174989

O=c1n(OCCO)c(=O)n(OCCO)c(=O)n1OCCO

nearest known ligand 0.33

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.33
MAPK1 P28482 1/20 0.33
KMT2A Q03164 2/20 0.32
MEN1 O00255 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5090318 0.74 PDE3B (0.31)
SCHEMBL4908811 0.67 ALDH1A1 (0.33)
SCHEMBL169531 0.67 MGLL (0.37) MAPK1
SCHEMBL5784730 0.65 ALOX12 (0.46) MAPK1KMT2A
SCHEMBL12123148 0.62 KMT2A (0.40) TSHRMAPK1KMT2AMEN1
SCHEMBL1532676 0.62 MEN1 (0.48) TSHRMAPK1KMT2AMEN1
SCHEMBL35878 0.61 PDE4A (0.39) TSHRMAPK1KMT2AMEN1
SCHEMBL1252839 0.59 TSHR (0.37) TSHRMAPK1KMT2AMEN1
SCHEMBL9718199 0.57 HSD17B10 (0.36) TSHRMAPK1KMT2AMEN1
Formaldehyde SCHEMBL8709282 0.57 CYP3A4 (0.38) TSHRMAPK1KMT2AMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115699254-A Planarization method and photocurable composition 佳能株式会社 2023-02-03 CN disclosed
CN-111116814-B Prepolymer, method of making, resin composition, and articles thereof 台光电子材料(昆山)有限公司 2022-08-30 CN disclosed
CN-114573760-A Prepolymers, resin compositions containing prepolymers, and articles thereof 台光电子材料股份有限公司 2022-06-03 CN disclosed
EP-1661932-B1 POLYESTER RESIN AND POLYESTER RESIN LAMINATE CONTAINER MITSUI CHEMICALS INC (JP) 2014-10-08 EP disclosed
US-7973122-B2 Polyamideimide compositions having multifunctional core structures GENERAL CABLE TECHNOLOGIES CORPORATION (US) 2011-07-05 US disclosed
US-20080160304-A1 Polyamideimide compositions having multifunctional core structures GENERAL CABLE TECHNOLOGIES 2008-07-03 US disclosed
CN-100366658-C Polyester resin and polyester resin laminate container MITSUI CHEMICALS INC (JP) 2008-02-06 CN disclosed
US-7153587-B2 Polyester resin and polyester resin laminate container MITSUI CHEMICALS, INC. (JP) 2006-12-26 US disclosed
US-20060204771-A1 POLYESTER RESIN AND POLYESTER RESIN LAMINATE CONTAINER MITSUI CHEMICALS, INC. (JP) 2006-09-14 US disclosed
EP-1661932-A1 POLYESTER RESIN AND POLYESTER RESIN LAMINATE CONTAINER Mitsui Chemicals, Inc. (JP) 2006-05-31 EP disclosed
US-20050282010-A1 Polyamideimide compositions having multifunctional core structures GENERAL CABLE TECHNOLOGIES CORPORATION 2005-12-22 US disclosed