SCHEMBL2202375

SCHEMBL2202375

Cc1cc(C(c2cc(C)c(O)c(C)c2)c2cc(Cc3ccc(O)c(C(c4cc(C)c(O)c(C)c4)c4cc(C)c(O)c(C)c4)c3)ccc2O)cc(C)c1O

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.52
ESR2 Q92731 1/20 0.52
CA1 P00915 1/20 0.42
CA2 P00918 1/20 0.42
CA4 P22748 1/20 0.42
CA6 P23280 1/20 0.42
THRA P10827 9/20 0.41
THRB P10828 9/20 0.41
PTGS1 P23219 2/20 0.38
PTGS2 P35354 2/20 0.38
IDH1 O75874 1/20 0.37
SHBG P04278 1/20 0.36
KLKB1 P03952 1/20 0.36
CTSB P07858 1/20 0.36
MMP9 P14780 1/20 0.36
DNMT1 P26358 1/20 0.36
DNMT3B Q9UBC3 1/20 0.36
DNMT3L Q9UJW3 1/20 0.36
DNMT3A Q9Y6K1 1/20 0.36
ALOX5 P09917 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22787078 0.88 ESR1 (0.47) ESR1ESR2CA1CA2CA4
SCHEMBL4456786 0.88 AMY1A (0.46) ESR1ESR2THRATHRBPTGS1
SCHEMBL2200658 0.87 ESR1 (0.61) ESR1ESR2CA1CA2CA4
SCHEMBL16812656 0.81 TP53 (0.47) ESR1CA1CA2PTGS1PTGS2
SCHEMBL4450887 0.78 ESR1 (0.46) ESR1ESR2THRATHRBMAPT
SCHEMBL5423042 0.78 ESR1 (0.53) ESR1ESR2CA1CA2CA4
SCHEMBL4062427 0.77 ESR1 (0.52) ESR1ESR2CA1CA2CA4
SCHEMBL2201491 0.77 ESR1 (0.56) ESR1ESR2CA1CA2CA4
SCHEMBL2856400 0.75 CA1 (0.38) ESR1ESR2CA1CA2PTGS1
SCHEMBL29372953 0.75 GABRA1 (0.47) CA1CA2PTGS1PTGS2ALOX5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 US disclosed
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same TORAY INDUSTRIES, INC. (JP) 2022-05-17 US disclosed
US-20200192227-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2020-06-18 US disclosed
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME TORAY INDUSTRIES, INC. (JP) 2018-01-11 US disclosed
US-20170299965-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-19 US disclosed
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP disclosed
EP-1496395-B1 Photosensitive resin precursor composition TORAY INDUSTRIES (JP) 2012-06-20 EP disclosed
EP-1862855-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2011-10-05 EP disclosed
US-7977400-B2 polyimide, unsaturated polymerizable compound, photoinitiator; crosslinkable to form addition-condensation copolymer or polyetherimide copolymer; no imidation of polymer through high-temperature heat treatment; alkaline development; polyimide film having excellent heat resistance, strength, elongation TORAY INDUSTRIES, INC. (JP) 2011-07-12 US disclosed
US-7910284-B2 Negative-tone photoresist material well suited to the EB lithography or the EUV (extreme ultraviolet light) lithography; high sensitivity, high resolution, and low line edge roughness HITACHI, LTD. (JP) 2011-03-22 US disclosed
US-20060159839-A1 Photosensitive resin composition, electronic component using the same, and display using same TORAY INDUSTRIES, INC. (JP) 2006-07-20 US disclosed
US-20060110680-A1 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2006-05-25 US disclosed
EP-1630605-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT AND DISPLAY USING SAME TORAY INDUSTRIES, INC. (JP) 2006-03-01 EP disclosed
US-6929890-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2005-08-16 US disclosed
US-20050014876-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-20 US disclosed
EP-1496395-A2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-12 EP disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed
EP-1375463-A1 OPTICALLY ACTIVE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION Kansai Research Institute, Inc. (JP) 2004-01-02 EP disclosed
US-20030211421-A1 Optically active compound and photosensitive resin composition KRI, INC. (JP) 2003-11-13 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME EED, RPL19, RARA ESR1 236/4885ESR2 348/4885CA1 4018/4885
US-20030211421-A1 Optically active compound and photosensitive resin composition ARCN1, RAD51, PAM ESR1 392/4885ESR2 895/4885CA1 1984/4885
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same EED, RPL19, RARA ESR1 236/4885ESR2 348/4885CA1 4018/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.