Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL20263531 | 0.84 | — | — | |
| SCHEMBL9194761 | 0.84 | LMNA (0.32) | — | |
| SCHEMBL3844670 | 0.80 | CA12 (0.36) | — | |
| SCHEMBL9452183 | 0.79 | LMNA (0.32) | — | |
| SCHEMBL28036930 | 0.78 | LMNA (0.36) | — | |
| SCHEMBL17732605 | 0.77 | ACHE (0.30) | — | |
| SCHEMBL537444 | 0.75 | CA12 (0.45) | — | |
| SCHEMBL3041583 | 0.75 | LMNA (0.33) | — | |
| SCHEMBL5916611 | 0.75 | CA12 (0.35) | — | |
| SCHEMBL7089998 | 0.74 | ALDH1A1 (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12363826-B2 | Copper-clad laminate, printed wiring board, semiconductor package and method for producing copper-clad laminate | RESONAC CORPORATION (JP) | 2025-07-15 | — | — | US | disclosed |
| CN-110982267-B | Thermosetting resin composition, method for producing same, prepreg, laminated board, and printed wiring board | 株式会社力森诺科 | 2024-03-08 | — | — | CN | disclosed |
| CN-110678505-B | Method for producing prepreg, laminated board, printed wiring board, and semiconductor package | 昭和电工材料株式会社 | 2022-08-23 | — | — | CN | disclosed |
| CN-110511566-B | Thermosetting resin composition, method for producing same, prepreg, laminate, and printed wiring board | 昭和电工材料株式会社 | 2022-06-03 | — | — | CN | disclosed |
| EP-3825121-A1 | COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE AND METHOD FOR PRODUCING COPPER-CLAD LAMINATE | Showa Denko Materials Co., Ltd. (JP) | 2021-05-26 | — | — | EP | disclosed |
| CN-112423982-A | Copper-clad laminate, printed wiring board, semiconductor package, and method for manufacturing copper-clad laminate | 昭和电工材料株式会社 | 2021-02-26 | — | — | CN | disclosed |
| WO-2020130008-A1 | COMPOSITE MATERIAL, METHOD OF MANUFACTURING SAME, PREPREG, LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 日立化成株式会社 | 2020-06-25 | — | — | WO | disclosed |
| CN-110982267-A | Thermosetting resin composition, method for producing same, prepreg, laminate, and printed wiring board | 日立化成株式会社 | 2020-04-10 | — | — | CN | disclosed |
| CN-110678505-A | Method for producing prepreg, laminate, printed wiring board, and semiconductor package | 日立化成株式会社 | 2020-01-10 | — | — | CN | disclosed |
| CN-109071778-B | Thermosetting resin composition, method for producing same, prepreg, laminate, and printed wiring board | HITACHI CHEMICAL CO.,LTD. (JP) | 2019-12-10 | — | — | CN | disclosed |