Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.31 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.31 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.31 |
| ▸ | GSK3B | P49841 | 1/20 | 0.31 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL448266 | 0.78 | — | — | |
| SCHEMBL3684087 | 0.77 | ALDH1A1 (0.46) | ALDH1A1TSHR | |
| SCHEMBL13169411 | 0.77 | MAOB (0.41) | ALDH1A1 | |
| SCHEMBL29926801 | 0.76 | ALDH1A1 (0.32) | ALDH1A1MAPK1 | |
| Hydrochloric Acid SCHEMBL28485238 | 0.76 | ALDH1A1 (0.32) | ALDH1A1MAPK1TRPA1GSK3BHIF1A | |
| SCHEMBL7363535 | 0.74 | TDP1 (0.40) | ALDH1A1MAPK1TSHR | |
| SCHEMBL3682860 | 0.74 | TP53 (0.38) | ALDH1A1MAPK1 | |
| SCHEMBL28598231 | 0.74 | LOXL2 (0.32) | ALDH1A1MAPK1 | |
| SCHEMBL13169407 | 0.72 | MAOA (0.42) | ALDH1A1 | |
| SCHEMBL23701116 | 0.70 | TSHR (0.30) | ALDH1A1MAPK1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-103003367-B | Curable resin composition and cured article | DAICEL CORP. (JP) | 2015-09-30 | — | — | CN | disclosed |
| CN-103154145-B | Curable resin composition and cured article | DAICEL CORP. (JP) | 2015-09-16 | — | — | CN | disclosed |
| US-8871890-B2 | Curable resin composition and cured article | DAICEL CORPORATION (JP) | 2014-10-28 | — | — | US | disclosed |
| EP-2636706-A1 | CURABLE RESIN COMPOSITION AND CURED ARTICLE | Daicel Corporation (JP) | 2013-09-11 | — | — | EP | disclosed |
| CN-103154145-A | Curable resin composition and cured article | DAICEL CORP | 2013-06-12 | — | — | CN | disclosed |
| US-20130131265-A1 | CURABLE RESIN COMPOSITION AND CURED ARTICLE | DAICEL CORPORATION (JP) | 2013-05-23 | — | — | US | disclosed |
| CN-103003367-A | Curable resin composition and cured product | DAICEL CORP | 2013-03-27 | — | — | CN | disclosed |
| US-8404584-B2 | Method of manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2013-03-26 | — | — | US | disclosed |
| US-20110207319-A1 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2011-08-25 | — | — | US | disclosed |