SCHEMBL22845011

SCHEMBL22845011

CC(C)OCc1ccc(N2C(=O)CCC2=O)cc1

nearest known ligand 0.50

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.50
POLB P06746 1/20 0.50
GLA P06280 1/20 0.45
KMT2A Q03164 7/20 0.43
CA12 O43570 2/20 0.42
CA1 P00915 2/20 0.42
CA9 Q16790 2/20 0.42
HPGD P15428 1/20 0.41
CA2 P00918 1/20 0.41
ATM Q13315 1/20 0.41
ALDH1A1 P00352 2/20 0.40
SMN1; SMN2 Q16637 2/20 0.40
MEN1 O00255 1/20 0.40
GFER P55789 1/20 0.39
GAA P10253 1/20 0.39
L3MBTL1 Q9Y468 2/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23616009 0.81 MGLL (0.58) LMNAKMT2AHPGDATMALDH1A1
SCHEMBL649272 0.75 IDO1 (0.44) POLB
SCHEMBL860679 0.75 LMNA (0.47) LMNAPOLBCA12CA1CA9
SCHEMBL370333 0.74 MGLL (0.62) LMNAPOLBGLAKMT2ACA12
SCHEMBL15317853 0.74 FAAH (0.59) LMNAPOLBGLAKMT2ACA12
SCHEMBL11478927 0.73 CA12 (0.67) LMNAPOLBGLAKMT2ACA12
SCHEMBL1337524 0.69 IDO1 (0.41)
SCHEMBL18844320 0.69 KMT2A (0.60) LMNAPOLBGLAKMT2ACA12
SCHEMBL6140262 0.68 KMT2A (0.58) LMNAPOLBGLAKMT2ACA12
SCHEMBL20609475 0.68 MAPT (0.59) LMNAPOLBKMT2AATMALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3916025-B1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL CO (JP) 2023-08-09 EP disclosed
EP-3919531-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-12-08 EP disclosed
EP-3916025-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-12-01 EP disclosed
WO-2020262579-A1 RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE 三菱瓦斯化学株式会社 2020-12-30 WO disclosed