SCHEMBL2345310

SCHEMBL2345310

CCOCc1cccc(-c2ccccc2)c1COCC

nearest known ligand 0.43

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CD274 Q9NZQ7 10/20 0.43
PDCD1 Q15116 1/20 0.43
DPP4 P27487 1/20 0.40
TACR1 P25103 1/20 0.40
FOLH1 Q04609 1/20 0.37
CHRNB2 P17787 1/20 0.37
CHRNA4 P43681 1/20 0.37
KMT2A Q03164 1/20 0.35
SCN8A Q9UQD0 1/20 0.35
FFAR1 O14842 1/20 0.35
FFAR4 Q5NUL3 1/20 0.35
ADRB2 P07550 1/20 0.34
NR3C1 P04150 1/20 0.34
AR P10275 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8679174 0.85 TACR1 (0.51) CD274PDCD1DPP4TACR1FOLH1
SCHEMBL4964134 0.81 ADRA1A (0.36) DPP4NR3C1
SCHEMBL49965 0.79 CD274 (0.46) CD274PDCD1DPP4FOLH1KMT2A
SCHEMBL21796063 0.77 TACR1 (0.38) DPP4TACR1CHRNB2CHRNA4KMT2A
SCHEMBL15671667 0.76 CD274 (0.35) CD274PDCD1DPP4TACR1CHRNB2
SCHEMBL28037389 0.75 CD274 (0.35) CD274PDCD1DPP4TACR1FOLH1
Ether SCHEMBL9138905 0.75 PTGS2 (0.43) CD274PDCD1DPP4ADRB2
Ether SCHEMBL9538327 0.75 TACR1 (0.56) CD274PDCD1DPP4TACR1CHRNB2
SCHEMBL648250 0.74 IDO1 (0.39) DPP4KMT2A
Ether SCHEMBL9719794 0.74 DPP4 (0.50) CD274PDCD1DPP4TACR1FOLH1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12378354-B2 Active ester resin, method for producing thereof, epoxy resin composition, cured product thereof, prepreg, laminated board, and material for circuit substrate NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2025-08-05 US disclosed
WO-2024071129-A1 ACTIVE ESTER RESIN, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF, PREPREG, LAMINATED BOARD, AND BUILD-UP FILM 日鉄ケミカル&マテリアル株式会社 2024-04-04 WO disclosed
US-20240043606-A1 POLYHYDRIC HYDROXY RESIN, EPOXY RESIN, AND THEIR PRODUCTION METHODS, AND EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2024-02-08 US disclosed
WO-2024024525-A1 EPOXY RESIN, RESIN COMPOSITION THEREOF, CURED OBJECT THEREFROM, AND METHOD FOR PRODUCING EPOXY RESIN 日鉄ケミカル&マテリアル株式会社 2024-02-01 WO disclosed
US-11884773-B2 Phenolic resin, epoxy resin, epoxy resin composition and cured product of same NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2024-01-30 US disclosed
EP-3620459-B9 PHOSPHORUS-CONTAINING PHENOLIC COMPOUND, PHOSPHORUS-CONTAINING EPOXY RESIN, CURABLE RESIN COMPOSITION THEREOF, OR EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL CHEMICAL & MAT CO LTD (JP) 2023-10-04 EP disclosed
US-20230272155-A1 PHENOL RESIN, EPOXY RESIN, METHODS FOR PRODUCING THESE, EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2023-08-31 US disclosed
US-20230242753-A1 THERMOSETTING RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2023-08-03 US disclosed
US-20230227601-A1 EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2023-07-20 US disclosed
US-20230227603-A1 EPOXY RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) 2023-07-20 US disclosed
CN-108623786-A Composition epoxy resin, its manufacturing method, curable resin composition and the hardening thing of Han oxazolidine ketone rings 新日铁住金化学株式会社 2018-10-09 CN disclosed
CN-103958561-B Lacquer resins and employ the composition epoxy resin of this lacquer resins MEIWA PLASTIC INDUSTRIES, LTD. (JP) 2016-04-27 CN disclosed
CN-103958561-A Linear phenol novolak resin and epoxy resin composition using same MEIWA PLASTIC IND LTD 2014-07-30 CN disclosed
CN-103897143-A Epoxy resin as well as preparation method and application thereof MEIWA PLASTIC IND LTD 2014-07-02 CN disclosed
CN-103140538-B Thermosetting resin composition, thermosetting products thereof, phenol resin, epoxy resin, and semiconductor sealing material DAINIPPON INK & CHEMICALS 2014-05-14 CN disclosed
EP-1595905-B1 PROCESS FOR PRODUCING HIGH-PURITY EPOXY RESIN AND EPOXY RESIN COMPOSITION NIPPON STEEL CHEMICAL CO (JP) 2011-08-31 EP disclosed
US-7268192-B2 Process for producing high-purity epoxy resin and epoxy resin composition TOHTO KASEI CO., LTD (JP) 2007-09-11 US disclosed
EP-1595905-A1 PROCESS FOR PRODUCING HIGH-PURITY EPOXY RESIN AND EPOXY RESIN COMPOSITION Tohto Kasei Co., Ltd. (JP) 2005-11-16 EP disclosed
US-20050131195-A1 Process for producing high-purity epoxy resin and epoxy resin composition NIPPON STEEL & SUMIKIN CHEMICAL CO., LTD. (JP) 2005-06-16 US disclosed
US-5840824-A A GLYCIDYLATED NOVOLAK TYPE RESIN WHICH IS PREPARED BY THE CONDENSATION OF BIPHENYL WITH PHENOLS AND NAPHTHOLS; WATER RESISTANCE, MECHANICAL STRENGTH NIPPON KAYAKU KABUSHIKI KAISHA (JP) 1998-11-24 US disclosed