Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CD274 | Q9NZQ7 | 12/20 | 0.46 |
| ▸ | PDCD1 | Q15116 | 1/20 | 0.46 |
| ▸ | DPP4 | P27487 | 1/20 | 0.42 |
| ▸ | PDK2 | Q15119 | 1/20 | 0.41 |
| ▸ | FOLH1 | Q04609 | 1/20 | 0.39 |
| ▸ | ADRB2 | P07550 | 1/20 | 0.38 |
| ▸ | ATR | Q13535 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8216183 | 0.86 | PDK2 (0.42) | CD274PDCD1PDK2KMT2A | |
| SCHEMBL792032 | 0.84 | DPP4 (0.54) | CD274PDCD1DPP4PDK2ADRB2 | |
| SCHEMBL29788053 | 0.84 | DPP4 (0.54) | CD274PDCD1DPP4PDK2ADRB2 | |
| SCHEMBL17898328 | 0.81 | CD274 (0.65) | CD274PDCD1 | |
| SCHEMBL4962884 | 0.80 | PDK2 (0.39) | PDK2KMT2A | |
| Hydrogen Sulfide SCHEMBL27779478 | 0.79 | KCNN4 (0.46) | CD274PDCD1DPP4PDK2ADRB2 | |
| SCHEMBL2345310 | 0.79 | CD274 (0.43) | CD274PDCD1DPP4FOLH1ADRB2 | |
| Acetaldehyde SCHEMBL28117642 | 0.78 | PPARA (0.39) | CD274PDCD1FOLH1 | |
| SCHEMBL21367487 | 0.77 | CD274 (0.58) | CD274 | |
| SCHEMBL1210904 | 0.76 | PTGER1 (0.51) | CD274DPP4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 927 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12547074-B2 | Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element | RESONAC CORPORATION (JP) | 2026-02-10 | — | — | US | claimed |
| US-20230236508-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT | RESONAC CORPORATION (JP) | 2023-07-27 | — | — | US | claimed |
| EP-4099090-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT | Showa Denko Materials Co., Ltd. (JP) | 2022-12-07 | — | — | EP | claimed |
| CN-115398339-A | Photosensitive resin composition, method for producing patterned cured film, and semiconductor device | 昭和电工材料株式会社 | 2022-11-25 | — | — | CN | claimed |
| WO-2021261448-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, PATTERNED CURED FILM AND SEMICONDUCTOR ELEMENT | 昭和電工マテリアルズ株式会社 | 2021-12-30 | — | — | WO | claimed |
| WO-2021260944-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM, AND SEMICONDUCTOR ELEMENT | 昭和電工マテリアルズ株式会社 | 2021-12-30 | — | — | WO | claimed |
| US-5945501-A | Epoxy resin compositions including novel phenol novolak condensates produced from bis(methoxymethyl)biphenyls | UBE INDUSTRIES, LTD. (JP) | 1999-08-31 | — | — | US | claimed |
| US-5612442-A | Phenol novolak condensate and bis(methoxymethyl)biphenyl for production thereof | UBE INDUSTRIES, LTD. (JP) | 1997-03-18 | — | — | US | claimed |
| JP-8143648-A | — | — | None | — | — | JP | disclosed |
| US-20260146153-A1 | RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE | RESONAC CORPORATION (JP) | 2026-05-28 | — | — | US | disclosed |
| WO-2026105609-A1 | COMPOSITION, LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 東レ株式会社 | 2026-05-21 | — | — | WO | disclosed |
| CN-122070345-A | Film-like adhesive, dicing die-bonding integrated film, and semiconductor device and method for manufacturing same | 株式会社力森诺科 | 2026-05-19 | — | — | CN | disclosed |
| US-20260117017-A1 | CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 2026-04-30 | — | — | US | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-5945501-A | Epoxy resin compositions including novel phenol novolak condensates produced from bis(methoxymethyl)biphenyls | UBE INDUSTRIES, LTD. (JP) | 1999-08-31 | — | — | US | disclosed |
| US-5840824-A | A GLYCIDYLATED NOVOLAK TYPE RESIN WHICH IS PREPARED BY THE CONDENSATION OF BIPHENYL WITH PHENOLS AND NAPHTHOLS; WATER RESISTANCE, MECHANICAL STRENGTH | NIPPON KAYAKU KABUSHIKI KAISHA (JP) | 1998-11-24 | — | — | US | disclosed |
| US-5612442-A | Phenol novolak condensate and bis(methoxymethyl)biphenyl for production thereof | UBE INDUSTRIES, LTD. (JP) | 1997-03-18 | — | — | US | disclosed |
| US-5612442-A | Phenol novolak condensate and bis(methoxymethyl)biphenyl for production thereof | UBE INDUSTRIES, LTD. (JP) | 1997-03-18 | — | — | US | disclosed |
| US-5612442-A | Phenol novolak condensate and bis(methoxymethyl)biphenyl for production thereof | UBE INDUSTRIES, LTD. (JP) | 1997-03-18 | — | — | US | disclosed |
| JP-H08143648-A | NEW PHENOLIC NOVOLAK CONDENSATE | MEIWA KASEI KK | 1996-06-04 | — | — | JP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | CD274 4105/4885PDCD1 4570/4885DPP4 4199/4885 |
| US-20260117017-A1 | CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF | ASIC1, TNF, WIZ | CD274 2611/4885PDCD1 4117/4885DPP4 3852/4885 |
| US-12547074-B2 | Photosensitive resin composition, method for producing patterned cured film, patterned cured film and semiconductor element | JMJD6, RARA, BCR | CD274 3521/4885PDCD1 3777/4885DPP4 4539/4885 |
| US-20260146153-A1 | RESIN COMPOSITION FOR MOLDING AND ELECTRONIC COMPONENT DEVICE | MYB, EED, RPS27L | CD274 1785/4885PDCD1 3782/4885DPP4 4518/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.