SCHEMBL23909548

SCHEMBL23909548

Cc1c(C(=O)O)ccc2ccc(C(=O)Cl)cc12

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ACE2 Q9BYF1 2/20 0.40
WDR5 P61964 1/20 0.40
LDHA P00338 1/20 0.39
ALDH1A1 P00352 4/20 0.38
KDM4E B2RXH2 2/20 0.38
THRB P10828 1/20 0.38
HPGD P15428 1/20 0.38
MYC P01106 1/20 0.38
PLA2G2D Q9UNK4 1/20 0.38
PTPN1 P18031 1/20 0.37
HSD17B10 Q99714 2/20 0.35
CDC25A P30304 1/20 0.35
CDC25B P30305 1/20 0.35
GABRP O00591 1/20 0.35
GABRD O14764 1/20 0.35
GABRA1 P14867 1/20 0.35
GABRB1 P18505 1/20 0.35
GABRG2 P18507 1/20 0.35
GABRB3 P28472 1/20 0.35
GABRA5 P31644 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909563 0.89 PTPN1 (0.46) ACE2WDR5LDHAALDH1A1KDM4E
SCHEMBL23909543 0.83 PTPN1 (0.48) ACE2WDR5LDHAALDH1A1KDM4E
SCHEMBL3374921 0.78 ALDH1A1 (0.49) ALDH1A1MYCHSD17B10CDC25ACDC25B
SCHEMBL23909573 0.77 ALDH1A1 (0.39) LDHAALDH1A1KDM4ETHRBHPGD
SCHEMBL2749203 0.76 PTPN1 (0.59) ACE2ALDH1A1KDM4ETHRBHPGD
SCHEMBL10650969 0.76 WDR5 (0.42) WDR5LDHAALDH1A1KDM4EHPGD
SCHEMBL23909558 0.74 LMNA (0.41) WDR5LDHAALDH1A1KDM4EHPGD
SCHEMBL4613753 0.74 HSD17B10 (0.59) ALDH1A1KDM4EHSD17B10CDC25ACDC25B
SCHEMBL6414851 0.73 KDM4E (0.59) ALDH1A1KDM4EHPGDHSD17B10SMN1; SMN2
SCHEMBL23630423 0.73 PTPN1 (0.47) ACE2WDR5LDHAALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed