SCHEMBL23909558

SCHEMBL23909558

Cc1c(C(=O)O)ccc2ccc(S(=O)(=O)Cl)cc12

nearest known ligand 0.41

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.41
WDR5 P61964 1/20 0.38
ACLY P53396 3/20 0.37
LDHA P00338 1/20 0.37
METAP2 P50579 1/20 0.36
HPGD P15428 2/20 0.35
KDM4E B2RXH2 1/20 0.35
ALDH1A1 P00352 1/20 0.35
HSD17B10 Q99714 1/20 0.35
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
TSHR P16473 1/20 0.34
PHLPP2 Q6ZVD8 1/20 0.34
GAA P10253 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
NPSR1 Q6W5P4 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909551 0.89 LMNA (0.40) LMNAACLYMETAP2HPGDKDM4E
SCHEMBL1279551 0.78 LMNA (0.46) LMNAACLYMETAP2HPGDKDM4E
SCHEMBL23909517 0.78 ALDH1A1 (0.37) LMNALDHAMETAP2HPGDKDM4E
SCHEMBL11582938 0.76 L3MBTL1 (0.50) LMNAHPGDKDM4EALDH1A1HSD17B10
SCHEMBL35163 0.75 KDM4E (0.51) LMNAACLYMETAP2HPGDKDM4E
Hydrochloric Acid SCHEMBL10767073 0.74 L3MBTL1 (0.49) LMNAHPGDKDM4EALDH1A1HSD17B10
SCHEMBL23909548 0.74 ACE2 (0.40) WDR5LDHAHPGDKDM4EALDH1A1
SCHEMBL10650969 0.73 WDR5 (0.42) LMNAWDR5LDHAHPGDKDM4E
SCHEMBL9516048 0.73 TSHR (0.57) LMNAACLYHPGDKDM4EALDH1A1
SCHEMBL1815167 0.73 ALDH1A1 (0.53) LMNAHPGDKDM4EALDH1A1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed