SCHEMBL24944347

SCHEMBL24944347

O=C(OC1C2CC3C1OC(=O)C3C2C(=O)OC1(c2ccccc2)CCNCC1)c1c2ccccc2cc2ccccc12

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24944344 0.89 LGALS9 (0.34) —
SCHEMBL24944348 0.89 LGALS9 (0.34) —
SCHEMBL24944358 0.88 OPRK1 (0.33) —
SCHEMBL24944345 0.86 — —
SCHEMBL26413959 0.85 RAB9A (0.37) —
SCHEMBL24944627 0.85 OPRM1 (0.32) —
SCHEMBL24944360 0.82 — —
SCHEMBL26413943 0.82 OPRM1 (0.32) —
SCHEMBL26413944 0.82 OPRM1 (0.30) —
SCHEMBL24943784 0.82 NLRP3 (0.31) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11644753-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-09 — — US disclosed
US-11644753-B2 Resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-05-09 — — US disclosed
US-20230131303-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-04-27 — — US disclosed
US-20230021453-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-01-26 — — US disclosed
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