Known targets — ChEMBL curated mechanism
GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQ
The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 12)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC22A1 | O15245 | 4/20 | 0.62 |
| ▸ | DNM1 | Q05193 | 2/20 | 0.44 |
| ▸ | SLC22A2 | O15244 | 1/20 | 0.40 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.40 |
| ▸ | LMNA | P02545 | 3/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.38 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.38 |
| ▸ | TSHR | P16473 | 1/20 | 0.38 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.38 |
| ▸ | SLC5A7 | Q9GZV3 | 1/20 | 0.38 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Water SCHEMBL3308149 | 1.00 | SLC22A1 (0.62) | SLC22A1DNM1SLC22A2SMN1; SMN2LMNA | |
| Water SCHEMBL597350 | 1.00 | SLC22A1 (0.62) | SLC22A1DNM1SLC22A2SMN1; SMN2LMNA | |
| SCHEMBL992673 | 0.97 | SLC22A1 (0.67) | SLC22A1DNM1SLC22A2SMN1; SMN2LMNA | |
| SCHEMBL2138636 | 0.97 | SLC22A1 (0.67) | SLC22A1DNM1SLC22A2SMN1; SMN2LMNA | |
| SCHEMBL14839961 | 0.97 | SLC22A1 (0.67) | SLC22A1DNM1SLC22A2SMN1; SMN2LMNA | |
| Bromide SCHEMBL18954325 | 0.94 | SLC22A1 (0.62) | SLC22A1DNM1SLC22A2SMN1; SMN2LMNA | |
| Bromide SCHEMBL31435645 | 0.94 | SLC22A1 (0.62) | SLC22A1DNM1SLC22A2SMN1; SMN2LMNA | |
| Fluoride Ion SCHEMBL17870609 | 0.94 | SLC22A1 (0.62) | SLC22A1DNM1SLC22A2SMN1; SMN2LMNA | |
| Water SCHEMBL27424443 | 0.94 | SLC22A1 (0.62) | SLC22A1DNM1SLC22A2SMN1; SMN2LMNA | |
| Hydrochloric Acid SCHEMBL7155406 | 0.94 | SLC22A1 (0.62) | SLC22A1DNM1SLC22A2SMN1; SMN2LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250154410-A1 | COMPOSITION, AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND ETCHING METHOD USING SAME | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-05-15 | — | — | US | disclosed |
| WO-2025063222-A1 | COMPOSITION AND KIT, AND METHOD FOR REMOVING RESIST AND METHOD FOR MANUFACTURING ELECTRONIC SUBSTRATE EACH USING THESE | 三菱瓦斯化学株式会社 | 2025-03-27 | — | — | WO | disclosed |
| EP-4485506-A1 | COMPOSITION, AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND ETCHING METHOD USING SAME | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2025-01-01 | — | — | EP | disclosed |
| CN-118715596-A | Composition, and method for manufacturing and etching semiconductor substrate using same | 三菱瓦斯化学株式会社 | 2024-09-27 | — | — | CN | disclosed |
| CN-118369621-A | Method for stripping resin mask | 花王株式会社 | 2024-07-19 | — | — | CN | disclosed |
| CN-111566567-B | Cleaning agent composition for stripping resin mask | 花王株式会社 | 2024-07-12 | — | — | CN | disclosed |
| CN-118202306-A | Method for producing printed wiring board, method for stripping resist, and resist stripping pretreatment liquid used for the methods | 三菱瓦斯化学株式会社 | 2024-06-14 | — | — | CN | disclosed |
| WO-2023163002-A1 | COMPOSITION, AND SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD AND ETCHING METHOD USING SAME | 三菱瓦斯化学株式会社 | 2023-08-31 | — | — | WO | disclosed |
| WO-2023145826-A1 | METHOD FOR DETACHING RESIN MASK | 花王株式会社 | 2023-08-03 | — | — | WO | disclosed |
| EP-4209284-A1 | FLUX CLEANING AGENT COMPOSITION | Kao Corporation (JP) | 2023-07-12 | — | — | EP | disclosed |
| WO-2023080235-A1 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD, METHOD FOR PEELING RESIST, AND RESIST PEELING PRETREATMENT LIQUID USED IN SAID METHODS | 三菱瓦斯化学株式会社 | 2023-05-11 | — | — | WO | disclosed |
| CN-116033975-A | Cleaning agent composition for soldering flux | 花王株式会社 | 2023-04-28 | — | — | CN | disclosed |
| CN-116018397-A | Method for cleaning substrate | 花王株式会社 | 2023-04-25 | — | — | CN | disclosed |
| CN-115280244-A | Method for cleaning substrate | 花王株式会社 | 2022-11-01 | — | — | CN | disclosed |
| WO-2022114110-A1 | CLEANING AGENT COMPOSITION FOR DETACHING RESIN MASK | 花王株式会社 | 2022-06-02 | — | — | WO | disclosed |
| WO-2022050386-A1 | METHOD FOR CLEANING SUBSTRATE | 花王株式会社 | 2022-03-10 | — | — | WO | disclosed |
| WO-2022050382-A1 | FLUX CLEANING AGENT COMPOSITION | 花王株式会社 | 2022-03-10 | — | — | WO | disclosed |
| CN-114008539-A | Cleaning method | 花王株式会社 | 2022-02-01 | — | — | CN | disclosed |