Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GABRA1 | P14867 | 4/20 | 0.48 |
| ▸ | GABRB2 | P47870 | 4/20 | 0.48 |
| ▸ | HTT | P42858 | 1/20 | 0.31 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.31 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.31 |
| ▸ | ELANE | P08246 | 1/20 | 0.31 |
| ▸ | CTSG | P08311 | 1/20 | 0.31 |
| ▸ | GABRG2 | P18507 | 1/20 | 0.30 |
| ▸ | GABRB3 | P28472 | 1/20 | 0.30 |
| ▸ | GABRA2 | P47869 | 1/20 | 0.30 |
| ▸ | ANPEP | P15144 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9745359 | 0.83 | GABRA1 (0.46) | GABRA1GABRB2HTTANPEP | |
| SCHEMBL1918647 | 0.80 | GABRA1 (0.52) | GABRA1GABRB2ELANECTSG | |
| SCHEMBL2522528 | 0.79 | GABRA1 (0.52) | GABRA1GABRB2ELANECTSG | |
| SCHEMBL9243360 | 0.77 | GABRA1 (0.54) | GABRA1GABRB2HTTELANECTSG | |
| SCHEMBL2518240 | 0.76 | CYP3A4 (0.40) | GABRA1GABRB2ELANECTSG | |
| SCHEMBL2743774 | 0.72 | GABRA1 (0.62) | GABRA1GABRB2ELANECTSGGABRG2 | |
| SCHEMBL273305 | 0.71 | GABRA1 (0.42) | GABRA1GABRB2HTTALOX15ALOX12 | |
| SCHEMBL2522716 | 0.71 | GABRA1 (0.42) | GABRA1GABRB2 | |
| SCHEMBL28646156 | 0.69 | GABRA1 (0.40) | GABRA1GABRB2ALOX15ALOX12ANPEP | |
| SCHEMBL9251033 | 0.69 | GABRA1 (0.41) | GABRA1GABRB2ALOX15ALOX12ELANE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117730398-A | Resin composition for dicing protective layer and method for processing semiconductor wafer | 株式会社力森诺科 | 2024-03-19 | — | — | CN | disclosed |
| US-9786576-B2 | Positive-type photosensitive resin composition, method for production of resist pattern, semiconductor device, and electronic device | HITACHI CHEMICAL COMPANY, LTD (JP) | 2017-10-10 | — | — | US | disclosed |
| US-20170165879-A1 | RESIN PRECURSOR, RESIN COMPOSITION CONTAINING SAME, POLYIMIDE RESIN MEMBRANE, RESIN FILM, AND METHOD FOR PRODUCING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2017-06-15 | — | — | US | disclosed |
| CN-105452386-A | Curable resin composition | YOKOHAMA RUBBER CO LTD | 2016-03-30 | — | — | CN | disclosed |
| US-9274422-B2 | Photosensitive resin composition, method for forming pattern-cured film using photosensitive resin composition, and electronic component | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2016-03-01 | — | — | US | disclosed |
| US-20140120462-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN-CURED FILM USING PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2014-05-01 | — | — | US | disclosed |
| EP-2221666-B1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL CO LTD (JP) | 2013-09-18 | — | — | EP | disclosed |
| US-20110250396-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | RESONAC CORPORATION (JP) | 2011-10-13 | — | — | US | disclosed |
| CN-101993537-A | Alkali-soluble polymer, photosensitive resin composition comprising the same, and uses of the same | ASAHI KASEI E MATERIALS CORP | 2011-03-30 | — | — | CN | disclosed |
| EP-2221666-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCTION OF RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | Hitachi Chemical Company, Ltd. (JP) | 2010-08-25 | — | — | EP | disclosed |
| US-20100159217-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERNS, AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD (JP) | 2010-06-24 | — | — | US | disclosed |