SCHEMBL2570914

SCHEMBL2570914

c1ccc(-c2ccccc2C2=NCCCO2)c(C2=NCCCO2)c1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NOS3 P29474 3/20 0.40
NOS2 P35228 2/20 0.40
NOS1 P29475 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
HDAC8 Q9BY41 2/20 0.36
HDAC4 P56524 1/20 0.36
ADRA2A P08913 3/20 0.36
ADRA2B P18089 3/20 0.36
ADRA2C P18825 3/20 0.36
ADRA1A P35348 1/20 0.36
MMP12 P39900 1/20 0.33
HDAC6 Q9UBN7 1/20 0.33
KCNN4 O15554 1/20 0.32
DNMT1 P26358 1/20 0.32
RAD52 P43351 1/20 0.32
UHRF1 Q96T88 1/20 0.32
CHRNB4 P30926 1/20 0.31
CHRNA3 P32297 1/20 0.31
ITGB2 P05107 1/20 0.31
ICAM1 P05362 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2572924 0.98 NOS3 (0.41) NOS3NOS2NOS1SMN1; SMN2HDAC8
SCHEMBL381604 0.87 SMN1; SMN2 (0.49) SMN1; SMN2ADRA2AADRA2BADRA2CMMP12
SCHEMBL25196779 0.85 ALDH1A1 (0.37) NOS3NOS2NOS1SMN1; SMN2HDAC8
SCHEMBL7963981 0.85 NOS3 (0.44) NOS3NOS2NOS1SMN1; SMN2HDAC8
SCHEMBL25211097 0.85 SMN1; SMN2 (0.36) NOS3NOS2NOS1SMN1; SMN2HDAC8
SCHEMBL10424020 0.85 NISCH (0.42) NOS3NOS2NOS1SMN1; SMN2
SCHEMBL29420719 0.85 SMN1; SMN2 (0.50) NOS3NOS2SMN1; SMN2ADRA2AADRA2B
SCHEMBL218213 0.85 SMN1; SMN2 (0.50) NOS3NOS2SMN1; SMN2ADRA2AADRA2B
SCHEMBL9319771 0.79 CHRNB4 (0.44) NOS3NOS2NOS1SMN1; SMN2ADRA2A
SCHEMBL7967638 0.78 ALDH1A1 (0.45) SMN1; SMN2ADRA2AADRA2BADRA2C

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4261250-A1 RESIN COMPOSITION, PELLET, MOLDED ARTICLE AND METHOD FOR PRODUCING RESIN COMPOSITION Mitsubishi Chemical Corporation (JP) 2023-10-18 EP disclosed
US-20230303826-A1 RESIN COMPOSITION, PELLET AND MOLDED ARTICLE, AND PROCESS FOR PRODUCING RESIN COMPOSITION MITSUBISHI CHEMICAL CORPORATION (JP) 2023-09-28 US disclosed
US-20220348762-A1 RESIN COMPOSITION, PELLET AND POWDER FOR USE IN POWDER ADDITIVE MANUFACTURING, METHOD FOR MANUFACTURING SHAPED ARTICLE, AND SHAPED ARTICLE MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2022-11-03 US disclosed
EP-3919554-A1 RESIN COMPOSITION FOR POWDER LAMINATION SHAPING METHOD, PELLETS, POWDER, METHOD FOR PRODUCING SHAPED ARTICLE, AND SHAPED ARTICLE Mitsubishi Engineering-Plastics Corporation (JP) 2021-12-08 EP disclosed
US-10472536-B2 Composition for forming laser direct structuring layer, kit, and method for manufacturing resin molded article with plated layer MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2019-11-12 US disclosed
EP-3162915-B1 COMPOSITION FOR FORMING LASER DIRECT STRUCTURING LAYER, KIT, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE WITH PLATING LAYER MITSUBISHI ENG PLASTICS CORP (JP) 2019-02-13 EP disclosed
US-20180363144-A1 LASER DIRECT STRUCTURING LAYER-FORMING COMPOSITION, KIT, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE WITH PLATED LAYER MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2018-12-20 US disclosed
EP-3396019-A1 COMPOSITION FOR FORMING LASER DIRECT STRUCTURING LAYER, KIT, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE HAVING PLATING LAYER Mitsubishi Engineering-Plastics Corporation (JP) 2018-10-31 EP disclosed
US-20170137660-A1 COMPOSITION FOR FORMING LASER DIRECT STRUCTURING LAYER, KIT, AND METHOD FOR MANUFACTURING RESIN MOLDED ARTICLE WITH PLATED LAYER MITSUBISHI ENGINEERING-PLASTICS CORPORATION (JP) 2017-05-18 US disclosed
EP-3162915-A1 COMPOSITION FOR FORMING LASER DIRECT STRUCTURING LAYER, KIT, AND METHOD FOR PRODUCING RESIN MOLDED ARTICLE WITH PLATING LAYER Mitsubishi Engineering-Plastics Corporation (JP) 2017-05-03 EP disclosed
EP-1466946-B1 FLAME-RETARDANT RESIN COMPOSITION POLYPLASTICS CO (JP) 2011-11-09 EP disclosed
US-7205346-B2 halogen-free, fireproof mixture of thermoplastic resins, containing phosphorus compounds, aromatic resins, nitrogen compounds, metal compounds, stabilizer agents and water repellants POLYPLASTICS CO., LTD. (JP) 2007-04-17 US disclosed
US-20040254270-A1 Flame-retardant resin composition POLYPLASTICS CO., LTD. (JP) 2004-12-16 US disclosed
EP-1466946-A1 FLAME-RETARDANT RESIN COMPOSITION Polyplastics Co., Ltd. (JP) 2004-10-13 EP disclosed