SCHEMBL260406

SCHEMBL260406

OCn1nnc2ccccc21

nearest known ligand 0.66

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC9A1 P19634 8/20 0.66
GRM2 Q14416 2/20 0.61
KCNMA1 Q12791 1/20 0.59
EGLN3 Q9H6Z9 1/20 0.59
RAB9A P51151 2/20 0.58
NPC1 O15118 1/20 0.58
MAPT P10636 1/20 0.58
MGAM O43451 1/20 0.57
AMY1A P0DUB6 1/20 0.57
GAA P10253 1/20 0.57
SI P14410 1/20 0.57
MGAM2 Q2M2H8 1/20 0.57
TDP1 Q9NUW8 1/20 0.56
GLA P06280 1/20 0.56
TSHR P16473 1/20 0.56
RPS6KA3 P51812 1/20 0.56
POLB P06746 2/20 0.55
MAPK1 P28482 1/20 0.55
ATM Q13315 1/20 0.55
APAF1 O14727 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Fluoride SCHEMBL31379726 0.98 SLC9A1 (0.63) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL23066359 0.84 SLC9A1 (0.61) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL2936169 0.84 SLC9A1 (0.68) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL1774497 0.83 SLC9A1 (0.70) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL31234269 0.83 SLC9A1 (0.70) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL9341979 0.82 SLC9A1 (0.63) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL29482278 0.81 SLC9A1 (0.70) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL7667067 0.81 SLC9A1 (0.70) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL7672509 0.80 SLC9A1 (0.71) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL20713929 0.80 SLC9A1 (0.56) SLC9A1GRM2KCNMA1EGLN3RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1400 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12630931-B2 Roughening solution for rolled copper foil and method for producing roughened copper foil MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2026-05-19 US claimed
US-12571105-B2 Metallic coated substrates ARMADILLO METAL COATINGS LTD (GB) 2026-03-10 US claimed
US-12565567-B2 Multifunctional smart particles SYNMATTER LLC (US) 2026-03-03 US claimed
CN-120137722-A Diesel engine oil for military high-power heavy vehicle and its production process 道骐科技有限公司 2025-06-13 CN claimed
US-12312528-B2 Etchant composition and manufacturing method of display device using the same SAMSUNG DISPLAY CO., LTD. (KR) 2025-05-27 US claimed
CN-119931782-A Efficient circuit board stripping liquid and preparation method and stripping method thereof 信丰超淦科技有限公司 2025-05-06 CN claimed
WO-2025013869-A1 FLUORINE-CONTAINING POLYMER HAVING NITROGEN-CONTAINING AROMATIC RING, PRODUCTION METHOD THEREFOR, AND COMPOSITION THEREOF ダイキン工業株式会社 2025-01-16 WO claimed
US-20250011940-A1 ROUGHENING SOLUTION FOR ROLLED COPPER FOIL AND METHOD FOR PRODUCING ROUGHENED COPPER FOIL MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-01-09 US claimed
CN-115679321-B Metal etching solution 深圳新宙邦科技股份有限公司 2024-12-13 CN claimed
CN-118755518-A Method for improving lubricating performance and cleaning performance of copper wire corrosion-resistant wiredrawing liquid 广州市联诺化工科技有限公司 2024-10-11 CN claimed
CN-101275065-A Lapping liquid FUJI FILM CORP (JP) 2008-10-01 CN claimed
CN-101255316-A Polishing liquid FUJIFILM CORP (JP) 2008-09-03 CN claimed
US-20080203354-A1 POLISHING LIQUID FUJIFILM CORPORATION (JP) 2008-08-28 US claimed
CN-101177602-A Lapping liquid FUJI FILM CORP (JP) 2008-05-14 CN claimed
WO-2007126672-A1 CMP METHOD FOR COPPER-CONTAINING SUBSTRATES CABOT MICROELECTRONICS CORPORATION (US) 2007-11-08 WO claimed
US-20070249167-A1 CMP method for copper-containing substrates CABOT MICROELECTRONICS CORPORATION (US) 2007-10-25 US claimed
US-20070181534-A1 Barrier polishing liquid and chemical mechanical polishing method FUJIFILM CORPORATION (JP) 2007-08-09 US claimed
CN-1860198-A non-polymeric organic particles for chemical mechanical polishing DYNEA CHEMICALS OY (FI) 2006-11-08 CN claimed
US-20020045679-A1 Aqueous ink composition HITACHI MAXELL, LTD. (JP) 2002-04-18 US claimed
US-5548003-A ADDUCT DISPERSED IN WATER-BASED PRINTING INK ARMSTRONG WORLD INDUSTRIES, INC. (US) 1996-08-20 US claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12565567-B2 Multifunctional smart particles KCNN3, KCNN1, KCNN2 SLC9A1 3051/4885GRM2 754/4885KCNMA1 45/4885
US-12630931-B2 Roughening solution for rolled copper foil and method for producing roughened copper foil SOD1, AOC2, TST SLC9A1 122/4885GRM2 1707/4885KCNMA1 1098/4885
US-12571105-B2 Metallic coated substrates SOD1, TET1, TST SLC9A1 675/4885GRM2 2826/4885KCNMA1 414/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.