SCHEMBL2707994

SCHEMBL2707994

O=C(O)c1ccc(Oc2ccccc2C2(c3ccccc3Oc3ccc(C(=O)O)c(C(=O)O)c3)c3cc(C45CC6CC(CC(C6)C4)C5)ccc3-c3ccc(C45CC6CC(CC(C6)C4)C5)cc32)cc1C(=O)O

nearest known ligand 0.42

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
HIF1A Q16665 4/20 0.42
EPAS1 Q99814 3/20 0.42
KDM4E B2RXH2 1/20 0.38
PYGL P06737 6/20 0.38
POLB P06746 1/20 0.38
SERPINE1 P05121 2/20 0.37
PYGM P11217 7/20 0.37
MEN1 O00255 1/20 0.36
RAB9A P51151 1/20 0.36
KMT2A Q03164 1/20 0.36
HPSE Q9Y251 1/20 0.34
EPHX2 P34913 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2707905 0.88 HIF1A (0.42) HIF1AEPAS1KDM4ESERPINE1MEN1
SCHEMBL2707997 0.86 POLB (0.41) HIF1AEPAS1POLBSERPINE1MEN1
SCHEMBL2706851 0.83 KDM4E (0.41) HIF1AEPAS1KDM4EPYGLPOLB
SCHEMBL2707999 0.83 PYGM (0.36) HIF1AEPAS1KDM4EPYGLPOLB
SCHEMBL2708799 0.82 HIF1A (0.43) HIF1AEPAS1KDM4EPYGLPOLB
SCHEMBL2709586 0.81 MEN1 (0.46) HIF1AEPAS1KDM4EPOLBSERPINE1
SCHEMBL2710476 0.81 MEN1 (0.39) HIF1AEPAS1POLBSERPINE1MEN1
SCHEMBL2706767 0.81 ALDH1A1 (0.47) HIF1AEPAS1KDM4EPOLBMEN1
SCHEMBL2707238 0.81 MEN1 (0.40) HIF1AEPAS1POLBMEN1RAB9A
SCHEMBL2708781 0.81 POLB (0.44) HIF1AEPAS1KDM4EPYGLPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2000510-B1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM SUMITOMO BAKELITE CO (JP) 2012-05-02 EP disclosed
US-7863347-B2 Resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2011-01-04 US disclosed
US-7652125-B2 Resin composition, polyimide resin composition, polybenzoxazole resin composition, varnish, resin film and semiconductor device using the same SUMITOMO BAKELITE COMPANY, LTD. (JP) 2010-01-26 US disclosed
US-20090118431-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE USING THE SAME SUMITOMO BAKELITE COMPANY, LTD (JP) 2009-05-07 US disclosed
EP-2000510-A1 RESIN COMPOSITION, VARNISH, RESIN FILM, AND SEMICONDUCTOR DEVICE USING THE RESIN FILM Sumitomo Bakelite Company, Ltd. (JP) 2008-12-10 EP disclosed
US-20080255335-A1 Resin Composition, Polyimide Resin Composition, Polybenzoxazole Resin Composition, Varnish, Resin Film and Semiconductor Device Using the Same SUMITOMO BAKELITE COMPANY LTD. (JP) 2008-10-16 US disclosed
EP-1813637-A1 RESIN COMPOSITION, POLYIMIDE RESIN COMPOSITION, POLY- BENZOXAZOLE RESIN COMPOSITION, VARNISHES, RESIN FILMS AND SEMICONDUCTOR DEVICES MADE BY USING THE SAME Sumitomo Bakelite Company, Limited (JP) 2007-08-01 EP disclosed