Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | GABRA1 | P14867 | 4/20 | 0.50 |
| ▸ | GABRB2 | P47870 | 2/20 | 0.50 |
| ▸ | GABRG2 | P18507 | 2/20 | 0.46 |
| ▸ | GABRB3 | P28472 | 2/20 | 0.46 |
| ▸ | LMNA | P02545 | 2/20 | 0.46 |
| ▸ | TSHR | P16473 | 2/20 | 0.46 |
| ▸ | FAAH | O00519 | 2/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.46 |
| ▸ | GABRB1 | P18505 | 2/20 | 0.46 |
| ▸ | CA1 | P00915 | 1/20 | 0.46 |
| ▸ | CA2 | P00918 | 1/20 | 0.46 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.46 |
| ▸ | HPGD | P15428 | 1/20 | 0.46 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.46 |
| ▸ | SLC6A2 | P23975 | 1/20 | 0.46 |
| ▸ | HTR2C | P28335 | 1/20 | 0.46 |
| ▸ | GABRA5 | P31644 | 1/20 | 0.46 |
| ▸ | GABRA3 | P34903 | 1/20 | 0.46 |
| ▸ | HTR2B | P41595 | 1/20 | 0.46 |
| ▸ | GABRA2 | P47869 | 1/20 | 0.46 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2194679 | 0.79 | GABRA1 (0.43) | GABRA1GABRB2GABRG2GABRB3LMNA | |
| SCHEMBL2099008 | 0.76 | GABRA1 (0.44) | GABRA1GABRB2GABRG2GABRB3LMNA | |
| SCHEMBL28741038 | 0.74 | GABRA1 (0.43) | GABRA1GABRB2GABRG2GABRB3LMNA | |
| Hydrogen Peroxide SCHEMBL30120583 | 0.73 | GABRA1 (0.65) | GABRA1GABRB2GABRG2GABRB3LMNA | |
| Hydrogen Peroxide SCHEMBL20593356 | 0.73 | GABRA1 (0.65) | GABRA1GABRB2GABRG2GABRB3LMNA | |
| Hydrogen Peroxide SCHEMBL29394264 | 0.73 | GABRA1 (0.65) | GABRA1GABRB2GABRG2GABRB3LMNA | |
| Methyl Alcohol SCHEMBL10709170 | 0.73 | GABRA1 (0.65) | GABRA1GABRB2GABRG2GABRB3LMNA | |
| Hydrogen Peroxide SCHEMBL35519 | 0.73 | GABRA1 (0.65) | GABRA1GABRB2GABRG2GABRB3LMNA | |
| Hydrogen Peroxide SCHEMBL99126 | 0.73 | GABRA1 (0.65) | GABRA1GABRB2GABRG2GABRB3LMNA | |
| SCHEMBL5002926 | 0.73 | GABRA1 (0.41) | GABRA1GABRB2GABRG2GABRB3LMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 116 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | HD MICROSYSTEMS, LTD. (JP) | 2026-04-14 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-12504688-B2 | Negative photosensitive resin composition and method for manufacturing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-23 | — | — | US | disclosed |
| US-20250370339-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR MANUFACTURING CURED RELIEF PATTERN | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-12-04 | — | — | US | disclosed |
| US-20250362601-A1 | Photosensitive Resin Composition, Method Of Manufacturing Pattern Cured Film, Cured Film, Interlayer Insulating Film, Cover Coat Layer, Surface Protective Film, And Electronic Component | HD MICROSYSTEMS LTD (JP) | 2025-11-27 | — | — | US | disclosed |
| US-20250341778-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING POLYIMIDE AND CURED RELIEF PATTERN USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-11-06 | — | — | US | disclosed |
| US-12405198-B2 | Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor device | RESONAC CORPORATION (JP) | 2025-09-02 | — | — | US | disclosed |
| US-12386259-B2 | Negative-type photosensitive resin composition and method for producing polyimide and cured relief pattern using same | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2025-08-12 | — | — | US | disclosed |
| US-20100159217-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERNS, AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD (JP) | 2010-06-24 | — | — | US | disclosed |
| US-20100092879-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2010-04-15 | — | — | US | disclosed |
| US-7638254-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2009-12-29 | — | — | US | disclosed |
| EP-2133743-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART | Hitachi Chemical DuPont Microsystems, Ltd. (JP) | 2009-12-16 | — | — | EP | disclosed |
| US-20090181224-A1 | NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2009-07-16 | — | — | US | disclosed |
| US-20090011364-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART | HATTORI TAKASHI | 2009-01-08 | — | — | US | disclosed |
| US-7435525-B2 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2008-10-14 | — | — | US | disclosed |
| US-20080076849-A1 | POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2008-03-27 | — | — | US | disclosed |
| US-20070122733-A1 | Positive photosensitive resin composition, method for forming pattern, and electronic part | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| EP-1744213-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT | Hitachi Chemical DuPont Microsystems Ltd. (JP) | 2007-01-17 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | GABRA1 186/4885GABRB2 311/4885GABRG2 147/4885 |
| US-12601970-B2 | Photosensitive resin composition, method for manufacturing patterned cured product, cured product, interlayer insulating film, cover coat layer, surface protective film, and electronic component | ARCN1, P4HA1, COL1A1 | GABRA1 892/4885GABRB2 1014/4885GABRG2 1445/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | GABRA1 66/4885GABRB2 170/4885GABRG2 396/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.