SCHEMBL2747334

SCHEMBL2747334

C#Cc1ccc2c(-c3c(Oc4ccc(N)c(O)c4)ccc4cc(C#C)ccc34)c(Oc3ccc(N)c(O)c3)ccc2c1

nearest known ligand 0.40

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.36
RCE1 Q9Y256 1/20 0.36
NR4A1 P22736 1/20 0.33
LMNA P02545 1/20 0.33
MAPT P10636 1/20 0.33
HTT P42858 1/20 0.33
MMP2 P08253 1/20 0.32
MMP14 P50281 1/20 0.32
ESR1 P03372 1/20 0.30
ESR2 Q92731 1/20 0.30
CYP3A4 P08684 1/20 0.30
ALOX15 P16050 1/20 0.30
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2747566 0.84 ASIC3 (0.41) GAARCE1LMNAMAPTHTT
SCHEMBL2747475 0.78 GAA (0.49) GAARCE1LMNAMAPTHTT
SCHEMBL2747065 0.78 MMP2 (0.31) MMP2MMP14
SCHEMBL2747567 0.76 ESR1 (0.41) GAARCE1LMNAMAPTHTT
SCHEMBL2747603 0.74 NR4A1 (0.40) GAARCE1NR4A1LMNAMAPT
SCHEMBL6129315 0.72 HSD17B1 (0.41) MAPTESR1ESR2CYP3A4
SCHEMBL4439736 0.72 ALOX15 (0.50) GAAMAPTCYP3A4ALOX15HSD17B10
SCHEMBL2749941 0.71 NR4A1 (0.40) GAARCE1NR4A1MAPTMMP2
SCHEMBL4840838 0.70 NR4A1 (0.54) GAARCE1NR4A1LMNAMAPT
SCHEMBL2748123 0.70 ESR1 (0.36) GAANR4A1MAPTMMP2MMP14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8337982-B2 Comprising first repeating unit obtained by reaction of bisaminophenol compound and dicarboxylic acid, at least one of which has diamondoid structure and second repeating unit obtained by reaction of bisaminophenol compound having no diamondoid structure and dicarboxylic acid; heat resistance SUMITOMO BAKELITE CO., LTD. (JP) 2012-12-25 US disclosed
US-8178631-B2 Resin composition, varnish, resin film and semiconductor device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2012-05-15 US disclosed
US-20090214860-A1 Resin Composition, Varnish, Resin Film and Semiconductor Device SUMITOMO BAKELITE COMPANY, LTD. (JP) 2009-08-27 US disclosed
US-20080206548-A1 Benzoxazole Resin Precursor, Polybenzoxazole Resin, Resin Film And Semiconductor Device SUMITOMO BAKELITE CO., LTD (JP) 2008-08-28 US disclosed
EP-1953181-A1 RESIN COMPOSITION, VARNISH, RESIN FILM AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Ltd. (JP) 2008-08-06 EP disclosed
EP-1832619-A1 BENZOXAZOLE RESIN PRECURSOR, POLYBENZOXAZOLE RESIN, RESIN FILM, AND SEMICONDUCTOR DEVICE Sumitomo Bakelite Company, Limited (JP) 2007-09-12 EP disclosed