SCHEMBL27615395

SCHEMBL27615395

NCc1cc(O)c(C2CCCCC2)cc1Cc1cccc(O)c1

nearest known ligand 0.45

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ NUDT1 P36639 1/20 0.45
▸ BACE1 P56817 1/20 0.45
▸ ENPP2 Q13822 1/20 0.43
▸ OPRM1 P35372 9/20 0.40
▸ OPRD1 P41143 9/20 0.40
▸ OPRK1 P41145 9/20 0.40
▸ DRD2 P14416 1/20 0.38
▸ DRD1 P21728 1/20 0.38
▸ TAAR1 Q96RJ0 1/20 0.38
▸ DHFR P00374 1/20 0.38
▸ TLR8 Q9NR97 1/20 0.37
▸ BCL2 P10415 1/20 0.36
▸ BCL2L1 Q07817 1/20 0.36
▸ ESR1 P03372 1/20 0.36
▸ ESR2 Q92731 1/20 0.36
▸ TYR P14679 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27548577 0.86 NUDT1 (0.51) NUDT1BACE1BCL2BCL2L1ESR1
SCHEMBL27522139 0.85 NUDT1 (0.53) NUDT1BACE1DRD2DRD1TAAR1
SCHEMBL27498112 0.84 OPRM1 (0.40) NUDT1BACE1OPRM1OPRD1OPRK1
SCHEMBL27870516 0.81 NUDT1 (0.45) NUDT1BACE1OPRM1OPRD1OPRK1
SCHEMBL27602507 0.79 NUDT1 (0.58) NUDT1BACE1OPRM1OPRD1OPRK1
SCHEMBL27584497 0.78 OPRM1 (0.44) OPRM1OPRD1OPRK1DHFRTLR8
SCHEMBL28248490 0.76 NUDT1 (0.40) NUDT1BACE1ENPP2OPRM1OPRD1
SCHEMBL30893631 0.75 OPRM1 (0.42) NUDT1BACE1OPRM1OPRD1OPRK1
SCHEMBL29186093 0.75 OPRM1 (0.42) NUDT1BACE1OPRM1OPRD1OPRK1
SCHEMBL28113973 0.75 NUDT1 (0.48) NUDT1BACE1ESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107870516-A Positive photosensitive resin composition, patterned film and method for manufacturing bump 奇美实业股份有限公司 2018-04-03 — — CN disclosed
CN-107561863-A Positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2018-01-09 — — CN disclosed
CN-107179652-A Positive photosensitive polysiloxane composition and application thereof 奇美实业股份有限公司 2017-09-19 — — CN disclosed
CN-103885294-B Photosensitive polysiloxane composition, protective film and element with protective film 奇美实业股份有限公司 2017-07-14 — — CN disclosed
CN-106918989-A Photosensitive polysiloxane composition, protective film and module with protective film 奇美实业股份有限公司 2017-07-04 — — CN disclosed
CN-106918994-A Photosensitive resin composition for black matrix and application thereof 奇美实业股份有限公司 2017-07-04 — — CN disclosed
CN-106909028-A Photosensitive resin composition, protective film and liquid crystal display element 奇美实业股份有限公司 2017-06-30 — — CN disclosed
CN-106338888-A Photosensitive resin composition, protective film and element 奇美实业股份有限公司 2017-01-18 — — CN disclosed
CN-103728833-B Photosensitive resin composition, protective film and element with protective film 奇美实业股份有限公司 2017-01-04 — — CN disclosed
CN-103885289-B Photosensitive resin composition, color filter and liquid crystal display element thereof 奇美实业股份有限公司 2017-01-04 — — CN disclosed
CN-102841504-A Positive photosensitive resin composition and method for forming pattern using the same CHI MEI CORP 2012-12-26 — — CN disclosed
CN-102778816-A Positive photosensitive resin composition and method for forming pattern using the same CHI MEI COOPERATION 2012-11-14 — — CN disclosed
CN-102566273-A Positive photosensitive resin composition and method for forming pattern QIMEI IND CO LTD 2012-07-11 — — CN disclosed
CN-102540727-A Photo-curing polysiloxane composition and substrate protective film formed by same CHI MEI CORP 2012-07-04 — — CN disclosed
CN-102445852-A Positive photosensitive resin composition and method for forming pattern CHI MEI CORP 2012-05-09 — — CN disclosed
CN-102443265-A Photo-curing polysiloxane composition and substrate protective film formed by same CHI MEI CORP 2012-05-09 — — CN disclosed
CN-102346372-A Positive photosensitive resin composition and method for forming pattern using the same CHI MEI CORP 2012-02-08 — — CN disclosed
CN-101907827-B Positive photosensitive resin composition and liquid crystal orientation control protrusion formed therefrom CHI MEI IND CO LTD 2011-11-23 — — CN disclosed
CN-101907827-A Positive photosensitive resin composition and liquid crystal orientation control protrusion formed therefrom CHI MEI IND CO LTD 2010-12-08 — — CN disclosed
CN-1584742-A Positive light sensitive resin composition QIMEI IND CO LTD (CN) 2005-02-23 — — CN disclosed
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