SCHEMBL2773100

SCHEMBL2773100

O=C(c1c(-c2ccccc2)cccc1-c1ccccc1)P(=O)(c1ccccc1)c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FOLH1 Q04609 1/20 0.46
KMT2A Q03164 2/20 0.44
HNF4A P41235 1/20 0.42
BCAT2 O15382 1/20 0.40
CHRNB2 P17787 2/20 0.40
CHRNA4 P43681 2/20 0.40
CHRNB4 P30926 1/20 0.40
CHRNA3 P32297 1/20 0.40
KCNA5 P22460 1/20 0.39
PTGER1 P34995 1/20 0.39
PTGER4 P35408 1/20 0.39
PTGER3 P43115 1/20 0.39
PTGER2 P43116 1/20 0.39
CA2 P00918 1/20 0.39
CA4 P22748 1/20 0.39
CA5A P35218 1/20 0.39
DPP4 P27487 1/20 0.38
PDCD1 Q15116 1/20 0.38
CD274 Q9NZQ7 1/20 0.38
ALDH1A1 P00352 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2771672 0.89 FOLH1 (0.41) FOLH1KMT2AHNF4APDCD1CD274
SCHEMBL2688000 0.86 PTPN1 (0.45) FOLH1KMT2AKCNA5PTGER1PTGER4
SCHEMBL4181722 0.81 BCAT2 (0.53) KMT2AHNF4ABCAT2CHRNB2CHRNA4
SCHEMBL2773099 0.77 ALDH1A1 (0.40) KMT2AHNF4ABCAT2CHRNB2CHRNA4
SCHEMBL28417260 0.76 MCL1 (0.42) HPGDFFAR1FFAR4
SCHEMBL2770669 0.76 CA2 (0.40) KMT2ACA2CA4CA5AALDH1A1
SCHEMBL17023659 0.76 CES2 (0.48) KMT2ACA2CA4CA5AUSP2
SCHEMBL260684 0.76 HPGD (0.42) KMT2ACA2CA4CA5AALDH1A1
SCHEMBL67557 0.76 ALDH1A1 (0.47) KMT2ACA2CA4CA5AALDH1A1
SCHEMBL5811174 0.74 GABRA1 (0.42) KMT2ACA2CA4CA5AALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7723445-B2 Curable resin composition, molded product, and process for producing the same SHOWA HIGHPOLYMER CO., LTD. (JP) 2010-05-25 US disclosed
US-20090008834-A1 Curable resin composition, molded product, and process for producing the same SHOWA HIGHPOLYMER CO., LTD. (JP) 2009-01-08 US disclosed
EP-1785440-A1 CURABLE RESIN COMPOSITION, SHAPED ARTICLE AND METHOD FOR PRODUCING SAME Showa Highpolymer Co., Ltd. (JP) 2007-05-16 EP disclosed
EP-0825201-B2 Photocurable composition and curing process therefor SHOWA DENKO KK (JP) 2006-11-29 EP disclosed
US-20050221210-A1 Electrophotographic photoconductor and image formation method, image formation apparatus, and process cartridge for image formation apparatus using the electrophotographic photoconductor RICOH COMPANY, LTD. (JP) 2005-10-06 US disclosed
EP-0825201-B1 Photocurable composition and curing process therefor SHOWA DENKO KK (JP) 2002-02-27 EP disclosed
EP-1044777-A1 Molding method for corrosion-resistant FRP SHOWA DENKO KABUSHIKI KAISHA (JP) 2000-10-18 EP disclosed
EP-0825201-A1 Photocurable composition and curing process therefor SHOWA DENKO KABUSHIKI KAISHA (JP) 1998-02-25 EP disclosed