SCHEMBL278351

SCHEMBL278351

COc1cccc(C(c2cc(C)c(O)cc2C)c2cc(C)c(O)cc2C)c1O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 5/20 0.49
KDM4E B2RXH2 3/20 0.49
ALDH1A1 P00352 2/20 0.49
HPGD P15428 2/20 0.49
ALOX15 P16050 2/20 0.49
HSD17B10 Q99714 2/20 0.49
TP53 P04637 2/20 0.49
LMNA P02545 1/20 0.49
CYP3A4 P08684 1/20 0.49
ALOX12 P18054 1/20 0.49
MAPK1 P28482 1/20 0.49
G6PD P11413 1/20 0.44
CYP1A2 P05177 1/20 0.43
P4HB P07237 3/20 0.43
GUSB P08236 1/20 0.42
CYP2C19 P33261 2/20 0.42
CYP2D6 P10635 1/20 0.42
BCHE P06276 1/20 0.40
TYR P14679 1/20 0.40
ACHE P22303 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30375446 1.00 MAPT (0.49) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL12964141 0.82 TRPA1 (0.45) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL4056310 0.82 TP53 (0.44) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL7448667 0.80 MAPT (0.57) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL29908290 0.78 MAPT (0.47) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL2200629 0.78 MAPT (0.47) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL2200512 0.77 CYP1A2 (0.47) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL30375550 0.77 CYP1A2 (0.47) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL20808843 0.76 CYP2D6 (0.52) MAPTKDM4EALDH1A1HPGDALOX15
SCHEMBL28647603 0.76 CYP2D6 (0.52) MAPTKDM4EALDH1A1HPGDALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11640110-B2 Resin composition, method for producing heat-resistant resin film, and display device TORAY INDUSTRIES, INC. (JP) 2023-05-02 US disclosed
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same TORAY INDUSTRIES, INC. (JP) 2022-05-17 US disclosed
US-20200192227-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2020-06-18 US disclosed
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME TORAY INDUSTRIES, INC. (JP) 2018-01-11 US disclosed
US-20170299965-A1 RESIN COMPOSITION, METHOD FOR PRODUCING HEAT-RESISTANT RESIN FILM, AND DISPLAY DEVICE TORAY INDUSTRIES, INC. (JP) 2017-10-19 US disclosed
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP disclosed
US-8530003-B2 Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device FUJIFILM CORPORATION (JP) 2013-09-10 US disclosed
US-8530003-B2 Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device FUJIFILM CORPORATION (JP) 2013-09-10 US disclosed
EP-1496395-B1 Photosensitive resin precursor composition TORAY INDUSTRIES (JP) 2012-06-20 EP disclosed
US-20120115333-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2012-05-10 US disclosed
US-20080076849-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
EP-1862855-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2007-12-05 EP disclosed
US-20060159839-A1 Photosensitive resin composition, electronic component using the same, and display using same TORAY INDUSTRIES, INC. (JP) 2006-07-20 US disclosed
US-20060110680-A1 Photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2006-05-25 US disclosed
EP-1630605-A1 PHOTOSENSITIVE RESIN COMPOSITION, AND ELECTRONIC COMPONENT AND DISPLAY USING SAME TORAY INDUSTRIES, INC. (JP) 2006-03-01 EP disclosed
US-6929890-B2 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2005-08-16 US disclosed
US-20050014876-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-20 US disclosed
EP-1496395-A2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-01-12 EP disclosed
EP-1475665-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-11-10 EP disclosed
US-20040197703-A1 Positive-type photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2004-10-07 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180011402-A1 RESIN, PHOTOSENSITIVE RESIN COMPOSITION, ELECTRONIC COMPONENT AND DISPLAY DEVICE USING THE SAME EED, RPL19, RARA MAPT 960/4885KDM4E 1157/4885ALDH1A1 1480/4885
US-20120115333-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE CD79B, BRIX1, SMARCB1 MAPT 1292/4885KDM4E 387/4885ALDH1A1 1563/4885
US-11333976-B2 Resin, photosensitive resin composition, electronic component and display device using the same EED, RPL19, RARA MAPT 960/4885KDM4E 1157/4885ALDH1A1 1480/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.