SCHEMBL278380

SCHEMBL278380

Cc1cc(O)c(C)c(O)c1Cc1ccc(O)cc1

nearest known ligand 0.48

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
THRA P10827 2/20 0.48
THRB P10828 2/20 0.48
ESR1 P03372 3/20 0.45
ESR2 Q92731 3/20 0.45
SLC28A3 Q9HAS3 1/20 0.41
KEAP1 Q14145 1/20 0.39
NPC1 O15118 1/20 0.38
RAB9A P51151 1/20 0.38
IDH1 O75874 1/20 0.37
TMEM97 Q5BJF2 1/20 0.36
SIGMAR1 Q99720 1/20 0.36
KDM4E B2RXH2 1/20 0.35
GLA P06280 1/20 0.35
GAA P10253 1/20 0.35
HSD17B3 P37058 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
ERAP1 Q9NZ08 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27510893 0.86 BCL2 (0.46) IDH1KDM4EGLAGAAHSD17B3
SCHEMBL27645322 0.79 THRA (0.58) THRATHRBESR1ESR2SLC28A3
SCHEMBL24759726 0.77 ESR1 (0.52) THRATHRBESR1ESR2SLC28A3
SCHEMBL15799777 0.77 THRB (0.57) THRATHRBESR1ESR2SLC28A3
SCHEMBL6299900 0.76 THRA (0.49) THRATHRBESR1ESR2SLC28A3
SCHEMBL10717284 0.76 ESR1 (0.46) THRATHRBESR1ESR2SLC28A3
SCHEMBL2788843 0.76 ESR1 (0.46) THRATHRBESR1ESR2SLC28A3
SCHEMBL3480423 0.76 ESR1 (0.62) THRATHRBESR1ESR2SLC28A3
SCHEMBL1121520 0.76 ESR1 (0.62) THRATHRBESR1ESR2SLC28A3
SCHEMBL30168838 0.75 ESR1 (0.54) THRATHRBESR1ESR2SLC28A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8530003-B2 Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device FUJIFILM CORPORATION (JP) 2013-09-10 US disclosed
US-8530003-B2 Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device FUJIFILM CORPORATION (JP) 2013-09-10 US disclosed
US-8269358-B2 Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element SUMITOMO BAKELITE COMPANY LIMITED (JP) 2012-09-18 US disclosed
US-8269358-B2 Bis(aminophenol) derivative, process for producing same, polyamide resin, positive photosensitive resin composition, protective film, interlayer dielectric film, semiconductor device, and display element SUMITOMO BAKELITE COMPANY LIMITED (JP) 2012-09-18 US disclosed
US-8198006-B2 Process for producing semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2012-06-12 US disclosed
US-8198006-B2 Process for producing semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2012-06-12 US disclosed
US-20120115333-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2012-05-10 US disclosed
US-20120115333-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2012-05-10 US disclosed
US-8133550-B2 Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device FUJIFILM CORPORATION (JP) 2012-03-13 US disclosed
US-8133550-B2 Good breaking elongation characteristics, achievable high sensitivity and high film remaining rate, little in pattern size fluctuation at the heating time after lithographic process, capable of stable pattern formation; manufacturing a semiconductor device FUJIFILM CORPORATION (JP) 2012-03-13 US disclosed
US-20100044888-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT SUMITOMO BAKELITE COMPANY LIMITED (JP) 2010-02-25 US disclosed
US-20100044888-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT SUMITOMO BAKELITE COMPANY LIMITED (JP) 2010-02-25 US disclosed
US-7368205-B2 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device SUMITOMO BAKELITE CO., LTD. (JP) 2008-05-06 US disclosed
US-7368205-B2 Polyamide resin, positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device SUMITOMO BAKELITE CO., LTD. (JP) 2008-05-06 US disclosed
US-7361445-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY (JP) 2008-04-22 US disclosed
US-7361445-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY (JP) 2008-04-22 US disclosed
US-20080076849-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080076849-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-7238455-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY, LTD. (JP) 2007-07-03 US disclosed
US-7238455-B2 Mixture of alkali soluble resin, quinonediazide compound and alcohol SUMITOMO BAKELITE COMPANY, LTD. (JP) 2007-07-03 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20100044888-A1 BIS(AMINOPHENOL) DERIVATIVE, PROCESS FOR PRODUCING SAME, POLYAMIDE RESIN, POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, PROTECTIVE FILM, INTERLAYER DIELECTRIC FILM, SEMICONDUCTOR DEVICE, AND DISPLAY ELEMENT RARA, AASDHPPT, GABRP THRA 1210/4885THRB 3247/4885ESR1 403/4885
US-20120115333-A1 POLYBENZOXAZOLE PRECURSOR, PHOTOSENSITIVE RESIN COMPOSITION USING THE SAME, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE CD79B, BRIX1, SMARCB1 THRA 1211/4885THRB 1647/4885ESR1 383/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.