SCHEMBL28135807

SCHEMBL28135807

C=CC(=O)OCCC[SiH2]C(OC)OC.C=CC(=O)OCCC[SiH3].CCO[CH]OCC

nearest known ligand 0.42

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 7/20 0.42
HPGD P15428 1/20 0.42
ALDH1A1 P00352 3/20 0.39
CYP3A4 P08684 1/20 0.39
TP53 P04637 2/20 0.33
HIF1A Q16665 2/20 0.33
HSD17B10 Q99714 1/20 0.33
THRB P10828 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28201427 0.85 TSHR (0.40) TSHRTHRB
SCHEMBL140890 0.84 TSHR (0.53) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL16538074 0.80 TSHR (0.56) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL26918864 0.79 TSHR (0.59) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL21101830 0.79 TSHR (0.59) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL16537404 0.79 TSHR (0.59) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL29402140 0.79 TSHR (0.59) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL1024881 0.77 TSHR (0.43) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL138700 0.76 TSHR (0.54) TSHRHPGDALDH1A1CYP3A4TP53
SCHEMBL733860 0.76 TSHR (0.47) TSHRHPGDALDH1A1CYP3A4TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105189685-B Method for forming thermally conductive thermal radical cure silicone composition 道康宁公司 2017-08-08 CN disclosed
CN-104968751-B Curable silicone compositions comprising clustured functional polyorganosiloxanes and silicone reactive diluents 道康宁公司 2017-04-19 CN disclosed
CN-104968750-B Clustered functional polyorganosiloxanes, processes for forming same and methods for their use 道康宁公司 2017-04-19 CN disclosed
CN-104968749-B Stability hot radical curable organosilicon adhesive composition 道康宁公司 2017-03-29 CN disclosed