SCHEMBL28239503

SCHEMBL28239503

COc1ccc(N2CC=CN2)cc1

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTR3E A5X5Y0 1/20 0.44
HTR3B O95264 1/20 0.44
ADRB1 P08588 1/20 0.44
HTR3A P46098 1/20 0.44
HTR3D Q70Z44 1/20 0.44
HTR3C Q8WXA8 1/20 0.44
SIGMAR1 Q99720 1/20 0.44
POLB P06746 1/20 0.42
CA12 O43570 1/20 0.41
CA1 P00915 1/20 0.41
CA2 P00918 1/20 0.41
CA7 P43166 1/20 0.41
CA9 Q16790 1/20 0.41
CA14 Q9ULX7 1/20 0.41
CYP1A2 P05177 1/20 0.40
CYP2C9 P11712 1/20 0.40
KMT2A Q03164 3/20 0.39
MAPT P10636 3/20 0.39
MEN1 O00255 2/20 0.39
RAB9A P51151 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28318105 0.85 ADRB1 (0.44) HTR3EHTR3BADRB1HTR3AHTR3D
SCHEMBL11401376 0.84
SCHEMBL8942578 0.79 ALOX5 (0.43) ADRB1POLBMAPTRAB9AMGLL
SCHEMBL3384925 0.75 MAPT (0.36) POLBKMT2AMAPTMEN1RAB9A
SCHEMBL27932273 0.74 MEN1 (0.39) POLBKMT2AMAPTMEN1RAB9A
SCHEMBL44774 0.74 ALOX5 (0.39) HTR3EHTR3BADRB1HTR3AHTR3D
SCHEMBL13723499 0.71 MEN1 (0.42) CA9KMT2AMAPTMEN1GAA
SCHEMBL4793606 0.71 HTR3E (0.59) HTR3EHTR3BADRB1HTR3AHTR3D
SCHEMBL8600643 0.70 MEN1 (0.41) POLBKMT2AMAPTMEN1RAB9A
SCHEMBL3382349 0.68 SIRT6 (0.47) ADRB1POLBCA1CA2KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111527450-B Photosensitive resin laminate and method for producing same 旭化成株式会社 2023-08-08 CN disclosed
CN-108375874-B Photosensitive resin composition, photosensitive resin laminate, substrate having resist pattern formed thereon, and method for producing circuit board 旭化成株式会社 2021-10-22 CN disclosed
CN-111527450-A Photosensitive resin laminate and method for producing same 旭化成株式会社 2020-08-11 CN disclosed
CN-104781730-B Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board 日立化成株式会社 2020-03-06 CN disclosed
CN-108375874-A The manufacturing method of photosensitive polymer combination, photoresist laminated body, the substrate for being formed with corrosion-resisting pattern and circuit board 旭化成株式会社 2018-08-07 CN disclosed