Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.30 |
| ▸ | POLB | P06746 | 1/20 | 0.30 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | LMNA | P02545 | 1/20 | 0.30 |
| ▸ | MAPT | P10636 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28519204 | 0.98 | L3MBTL1 (0.32) | L3MBTL1 | |
| SCHEMBL27970356 | 0.91 | L3MBTL1 (0.31) | L3MBTL1TSHR | |
| SCHEMBL4434695 | 0.89 | L3MBTL1 (0.33) | L3MBTL1POLBTSHR | |
| SCHEMBL546851 | 0.86 | ALDH1A1 (0.39) | L3MBTL1KDM4EPOLBALDH1A1LMNA | |
| SCHEMBL4135231 | 0.85 | FAAH (0.40) | — | |
| SCHEMBL905562 | 0.84 | ALDH1A1 (0.38) | L3MBTL1KDM4EPOLBALDH1A1LMNA | |
| SCHEMBL28621128 | 0.84 | SIGMAR1 (0.31) | KDM4ETSHR | |
| SCHEMBL8437271 | 0.84 | ALDH1A1 (0.37) | KDM4EALDH1A1LMNA | |
| SCHEMBL6048632 | 0.79 | L3MBTL1 (0.35) | L3MBTL1POLBALDH1A1LMNAMAPT | |
| SCHEMBL9009668 | 0.77 | L3MBTL1 (0.37) | L3MBTL1POLBALDH1A1LMNAMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113355707-A | Electroplating additive containing copper salt and application and preparation method thereof | 刘玉亭 | 2021-09-07 | — | — | CN | claimed |
| CN-111321436-A | Cyanide-free copper plating solution assistant and copper plating solution | 张志梁 | 2020-06-23 | — | — | CN | claimed |
| CN-113355707-A | Electroplating additive containing copper salt and application and preparation method thereof | 刘玉亭 | 2021-09-07 | — | — | CN | disclosed |
| CN-111321436-B | Cyanide-free copper plating solution assistant and copper plating solution | 张志梁 | 2021-06-04 | — | — | CN | disclosed |
| CN-111321436-A | Cyanide-free copper plating solution assistant and copper plating solution | 张志梁 | 2020-06-23 | — | — | CN | disclosed |