SCHEMBL28656256

SCHEMBL28656256

Cc1c(C(=O)Cl)ccc2cccc(S(=O)(=O)Cl)c12

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.36
HSD17B10 Q99714 3/20 0.36
MEN1 O00255 3/20 0.36
ALDH1A1 P00352 3/20 0.36
KDM4E B2RXH2 2/20 0.36
TSHR P16473 1/20 0.36
RXFP1 Q9HBX9 1/20 0.36
CYP1A2 P05177 2/20 0.31
GLA P06280 1/20 0.31
POLB P06746 1/20 0.31
CYP2D6 P10635 1/20 0.31
HPGD P15428 1/20 0.31
MAPT P10636 1/20 0.31
MAPK1 P28482 1/20 0.31
NPSR1 Q6W5P4 1/20 0.31
TTR P02766 1/20 0.31
FABP4 P15090 1/20 0.31
CCNA2 P20248 1/20 0.31
CDK2 P24941 1/20 0.31
MAPK14 Q16539 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23909561 0.88 HSD17B10 (0.45) KMT2AHSD17B10MEN1ALDH1A1KDM4E
SCHEMBL12569842 0.80 ALDH1A1 (0.38) KMT2AHSD17B10MEN1ALDH1A1KDM4E
SCHEMBL8679628 0.79 ALDH1A1 (0.40) KMT2AHSD17B10MEN1ALDH1A1KDM4E
SCHEMBL23909535 0.73 MEN1 (0.49) KMT2AHSD17B10MEN1ALDH1A1KDM4E
SCHEMBL23909529 0.73 MEN1 (0.38) KMT2AHSD17B10MEN1ALDH1A1KDM4E
SCHEMBL23909531 0.71 CA1 (0.51) KMT2AHSD17B10MEN1ALDH1A1KDM4E
SCHEMBL30362324 0.71 CA1 (0.51) KMT2AHSD17B10MEN1ALDH1A1KDM4E
SCHEMBL27484504 0.70 BCAT2 (0.44) ALDH1A1
SCHEMBL3645882 0.69 ALDH1A1 (0.48) HSD17B10ALDH1A1TSHRPOLBFABP4
SCHEMBL4607896 0.68 HSD17B10 (0.48) KMT2AHSD17B10MEN1ALDH1A1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113527680-A Polymer, photosensitive resin composition, pattern forming method, cured film, and electronic component 信越化学工业株式会社 2021-10-22 CN disclosed