SCHEMBL23909529

SCHEMBL23909529

Cc1ccc2cccc(S(=O)(=O)Cl)c2c1C(=O)O

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.38
KMT2A Q03164 3/20 0.38
TDP1 Q9NUW8 2/20 0.36
L3MBTL1 Q9Y468 2/20 0.36
HSD17B10 Q99714 4/20 0.36
ALDH1A1 P00352 4/20 0.36
TSHR P16473 2/20 0.36
HPGD P15428 2/20 0.36
CYP3A4 P08684 1/20 0.36
KDM4E B2RXH2 2/20 0.36
RXFP1 Q9HBX9 1/20 0.36
FABP4 P15090 2/20 0.33
GLO1 Q04760 1/20 0.33
TTR P02766 1/20 0.33
CCNA2 P20248 1/20 0.33
CDK2 P24941 1/20 0.33
MAPK14 Q16539 1/20 0.33
DHODH Q02127 1/20 0.33
FABP3 P05413 1/20 0.33
NR4A1 P22736 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11625892 0.80 TDP1 (0.46) KMT2ATDP1L3MBTL1HSD17B10ALDH1A1
SCHEMBL23909561 0.79 HSD17B10 (0.45) MEN1KMT2AHSD17B10ALDH1A1TSHR
SCHEMBL23909521 0.77 APEX1 (0.38) MEN1KMT2ATDP1L3MBTL1HSD17B10
SCHEMBL7144245 0.76 TDP1 (0.46) MEN1KMT2ATDP1L3MBTL1HSD17B10
SCHEMBL7181510 0.76 HSD17B10 (0.56) MEN1KMT2ATDP1L3MBTL1HSD17B10
SCHEMBL23909552 0.75 HSD17B10 (0.43) MEN1KMT2ATDP1L3MBTL1HSD17B10
SCHEMBL3530146 0.74 METAP2 (0.37) MEN1KMT2ATDP1L3MBTL1HSD17B10
SCHEMBL28656256 0.73 KMT2A (0.36) MEN1KMT2AHSD17B10ALDH1A1TSHR
SCHEMBL23909565 0.72 PARP1 (0.47) MEN1KMT2ATDP1L3MBTL1HSD17B10
SCHEMBL7899541 0.68 ALOX15 (0.46) ALDH1A1TSHRFABP4FABP3NR4A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3896521-B1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHINETSU CHEMICAL CO (JP) 2022-12-14 EP disclosed
US-11333975-B2 Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic component INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2022-05-17 US disclosed
EP-3896521-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT Shin-Etsu Chemical Co., Ltd. (JP) 2021-10-20 EP disclosed
US-20210317268-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING METHOD, METHOD OF FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2021-10-14 US disclosed