Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC16A3 | O15427 | 4/20 | 0.64 |
| ▸ | MAOB | P27338 | 4/20 | 0.62 |
| ▸ | SLC16A1 | P53985 | 2/20 | 0.60 |
| ▸ | POLB | P06746 | 2/20 | 0.55 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.55 |
| ▸ | MEN1 | O00255 | 1/20 | 0.55 |
| ▸ | MIF | P14174 | 2/20 | 0.54 |
| ▸ | PFKFB3 | Q16875 | 1/20 | 0.54 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.53 |
| ▸ | HPGD | P15428 | 3/20 | 0.53 |
| ▸ | MAPT | P10636 | 2/20 | 0.53 |
| ▸ | KDM4E | B2RXH2 | 4/20 | 0.51 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.51 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.51 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.51 |
| ▸ | TSHR | P16473 | 1/20 | 0.51 |
| ▸ | USP2 | O75604 | 1/20 | 0.50 |
| ▸ | S1PR2 | O95136 | 1/20 | 0.50 |
| ▸ | S1PR4 | O95977 | 1/20 | 0.50 |
| ▸ | GLA | P06280 | 1/20 | 0.50 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2911594 | 0.84 | MAOB (0.80) | SLC16A3MAOBSLC16A1KMT2AMEN1 | |
| SCHEMBL28295864 | 0.84 | MIF (0.72) | SLC16A3MAOBPOLBKMT2AMEN1 | |
| SCHEMBL3366496 | 0.83 | POLB (0.71) | SLC16A3MAOBPOLBKMT2AMEN1 | |
| SCHEMBL28351884 | 0.82 | KDM4E (0.68) | SLC16A3MAOBSLC16A1POLBKMT2A | |
| SCHEMBL31669653 | 0.82 | SLC16A3 (0.68) | SLC16A3MAOBSLC16A1KMT2AMEN1 | |
| SCHEMBL28540565 | 0.81 | SLC16A3 (0.67) | SLC16A3MAOBSLC16A1POLBKMT2A | |
| SCHEMBL93300 | 0.81 | MAOB (0.85) | SLC16A3MAOB | |
| SCHEMBL28943174 | 0.81 | MAOB (0.73) | SLC16A3MAOBSLC16A1KMT2AMEN1 | |
| SCHEMBL24176806 | 0.80 | SLC16A3 (0.72) | SLC16A3MAOBSLC16A1KMT2AMEN1 | |
| SCHEMBL11938163 | 0.79 | MAOB (0.74) | SLC16A3MAOBSLC16A1KMT2AMIF |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 327 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111522200-B | Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof | 中国科学院化学研究所 | 2021-07-27 | — | — | CN | claimed |
| CN-111522200-A | Negative PSPI resin for 12-inch silicon wafer and preparation method and application thereof | 中国科学院化学研究所 | 2020-08-11 | — | — | CN | claimed |
| WO-2026100338-A1 | PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING CURED RELIEF PATTERN | 旭化成株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-28 | — | — | US | disclosed |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2026-04-16 | — | — | US | disclosed |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-04-09 | — | — | US | disclosed |
| US-20260063999-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-03-05 | — | — | US | disclosed |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2026-02-05 | — | — | US | disclosed |
| US-20260003281-A1 | RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2026-01-01 | — | — | US | disclosed |
| US-6482569-B1 | Process for forming a polyimide pattern with photosensitive composition for i-line stepper | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2002-11-19 | — | — | US | disclosed |
| EP-1219662-A1 | POLYAMIC ACID ESTER | Asahi Kasei Kabushiki Kaisha (JP) | 2002-07-03 | — | — | EP | disclosed |
| EP-0718696-B1 | Photosensitive polyimide precursor composition | ASAHI CHEMICAL IND (JP) | 2002-01-16 | — | — | EP | disclosed |
| US-6162580-A | Photosensitive polyimide precursor compositions processable by exposure to short wavelength light | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 2000-12-19 | — | — | US | disclosed |
| EP-0580108-B1 | A photosensitive polyimide composition | ASAHI CHEMICAL IND (JP) | 1997-03-12 | — | — | EP | disclosed |
| EP-0718696-A2 | A photosensitive polyimide composition | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1996-06-26 | — | — | EP | disclosed |
| US-5397682-A | Polyimide precursor and photosensitive composition containing the same | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1995-03-14 | — | — | US | disclosed |
| WO-1994006057-A1 | POLYIMIDE PRECURSOR AND PHOTOSENSITIVE COMPOSITION CONTAINING THE SAME | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1994-03-17 | — | — | WO | disclosed |
| EP-0580108-A2 | A photosensitive polyimide composition | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1994-01-26 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (8 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12613465-B2 | Photosensitive resin composition and method for producing cured relief pattern | ARCN1, GLRA1, PSMA1 | SLC16A3 1421/4885MAOB 4827/4885SLC16A1 1423/4885 |
| US-20260104641-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT | ARCN1, PRDM9, LBR | SLC16A3 3827/4885MAOB 3277/4885SLC16A1 4080/4885 |
| US-20260003281-A1 | RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | SEM1, SAT1, ASIC1 | SLC16A3 2298/4885MAOB 957/4885SLC16A1 910/4885 |
| US-20260099093-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN USING SAME, AND METHOD FOR PRODUCING POLYIMIDE FILM USING SAME | CD79B, ITGA1, PTK2 | SLC16A3 3127/4885MAOB 2517/4885SLC16A1 2520/4885 |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | SEM1, ASIC1, SMARCB1 | SLC16A3 3108/4885MAOB 3654/4885SLC16A1 2686/4885 |
| US-20260036904-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING CURED RELIEF PATTERN, AND SEMICONDUCTOR DEVICE | RER1, ASIC1, FRG1 | SLC16A3 3039/4885MAOB 3218/4885SLC16A1 2670/4885 |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | RER1, SEM1, RAD51 | SLC16A3 3649/4885MAOB 3321/4885SLC16A1 3402/4885 |
| US-20260063999-A1 | NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR POLYIMIDE CURED FILM USING SAME, AND POLYIMIDE CURED FILM | ARCN1, PBRM1, LCP1 | SLC16A3 2173/4885MAOB 3403/4885SLC16A1 1211/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.