Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KMT2A | Q03164 | 3/20 | 0.42 |
| ▸ | F2 | P00734 | 2/20 | 0.40 |
| ▸ | CTRC | Q99895 | 1/20 | 0.40 |
| ▸ | MAOB | P27338 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 5/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.37 |
| ▸ | RAB9A | P51151 | 2/20 | 0.37 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.37 |
| ▸ | NPC1 | O15118 | 1/20 | 0.37 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.37 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | CES2 | O00748 | 1/20 | 0.35 |
| ▸ | CES1 | P23141 | 1/20 | 0.35 |
| ▸ | NQO2 | P16083 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL36764 | 1.00 | KMT2A (0.42) | KMT2AF2CTRCMAOBMAPT | |
| SCHEMBL36763 | 1.00 | KMT2A (0.42) | KMT2AF2CTRCMAOBMAPT | |
| SCHEMBL6809982 | 0.87 | POLB (0.38) | KMT2AMAPTSMN1; SMN2MEN1RAB9A | |
| SCHEMBL4350596 | 0.84 | NPC1 (0.42) | KMT2AF2MAOBMAPTMEN1 | |
| SCHEMBL30529837 | 0.84 | NPC1 (0.42) | KMT2AF2MAOBMAPTMEN1 | |
| SCHEMBL4350592 | 0.84 | NPC1 (0.42) | KMT2AF2MAOBMAPTMEN1 | |
| SCHEMBL36510 | 0.83 | HSD11B1 (0.46) | KMT2AMAPTSMN1; SMN2RAB9AKDM4E | |
| SCHEMBL36511 | 0.83 | HSD11B1 (0.46) | KMT2AMAPTSMN1; SMN2RAB9AKDM4E | |
| SCHEMBL5918261 | 0.81 | EP300 (0.45) | F2MAPTKDM4EALDH1A1NQO2 | |
| SCHEMBL5918260 | 0.81 | EP300 (0.45) | F2MAPTKDM4EALDH1A1NQO2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120065622-A | Photosensitive resin composition and method for producing microlens | 东京应化工业株式会社 | 2025-05-30 | — | — | CN | disclosed |
| CN-114600045-B | Photosensitive resin composition, photosensitive dry film and pattern forming method | 信越化学工业株式会社 | 2025-05-09 | — | — | CN | disclosed |
| CN-119620544-A | Photosensitive resin composition, dry film, photosensitive dry film, resist film, molded substrate with mold, and method for producing plated molded article | 东京应化工业株式会社 | 2025-03-14 | — | — | CN | disclosed |
| CN-110317174-B | Hydrogen barrier agent, composition for forming hydrogen barrier film, method for producing hydrogen barrier film, and electronic device | 东京应化工业株式会社 | 2024-10-22 | — | — | CN | disclosed |
| CN-118829948-A | Method for manufacturing plating shaped article | 东京应化工业株式会社 | 2024-10-22 | — | — | CN | disclosed |
| CN-118742854-A | Chemically amplified positive photosensitive composition, method for producing molded substrate with mold, and method for producing plated molded article | 东京应化工业株式会社 | 2024-10-01 | — | — | CN | disclosed |
| CN-117590696-A | Photosensitive resin composition | 东京应化工业株式会社 | 2024-02-23 | — | — | CN | disclosed |
| CN-110647010-B | Resin composition, dry film, method for producing dry film, resist film, substrate, and method for producing plating molded article | 东京应化工业株式会社 | 2024-02-09 | — | — | CN | disclosed |
| CN-107615168-B | Radiation-sensitive composition | 日产化学工业株式会社 | 2023-12-19 | — | — | CN | disclosed |
| CN-109709770-B | Resin composition, dry film and method for producing same, method for producing resist film and substrate, method for producing plated molded article, and mercapto compound | 东京应化工业株式会社 | 2023-11-24 | — | — | CN | disclosed |
| CN-111217946-B | Composition comprising a compound containing a vinyl group | 东京应化工业株式会社 | 2022-12-06 | — | — | CN | disclosed |
| CN-108459469-B | Pattern forming method | 信越化学工业株式会社 | 2022-11-11 | — | — | CN | disclosed |
| CN-115087928-A | Resist pattern forming method | 东京应化工业株式会社 | 2022-09-20 | — | — | CN | disclosed |
| CN-107390472-B | Chemically amplified positive photosensitive resin composition | 东京应化工业株式会社 | 2022-09-06 | — | — | CN | disclosed |
| CN-114967342-A | Positive photosensitive composition and dry film, patterned resist film, substrate with mold, and method for producing plated molded article | 东京应化工业株式会社 | 2022-08-30 | — | — | CN | disclosed |
| CN-114967343-A | Positive photosensitive composition and dry film, patterned resist film, substrate with mold, and method for producing plated molded article | 东京应化工业株式会社 | 2022-08-30 | — | — | CN | disclosed |
| CN-114902134-A | Chemically amplified photosensitive composition, photosensitive dry film and method for producing same, method for producing resist film, and acid diffusion inhibitor | 东京应化工业株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-114641727-A | Method for producing photosensitive composition, premix for production, photosensitive composition, dry film, and method for producing resist film | 东京应化工业株式会社 | 2022-06-17 | — | — | CN | disclosed |
| CN-114600045-A | Photosensitive resin composition, photosensitive dry film and pattern forming method | 信越化学工业株式会社 | 2022-06-07 | — | — | CN | disclosed |
| CN-114207524-A | Resin composition, dry film, resist film, compound, acid generator, and method for producing N-organic sulfonyloxy compound | 东京应化工业株式会社 | 2022-03-18 | — | — | CN | disclosed |