Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KMT2A | Q03164 | 3/20 | 0.42 |
| ▸ | F2 | P00734 | 2/20 | 0.40 |
| ▸ | CTRC | Q99895 | 1/20 | 0.40 |
| ▸ | MAOB | P27338 | 1/20 | 0.38 |
| ▸ | MAPT | P10636 | 5/20 | 0.38 |
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.38 |
| ▸ | MEN1 | O00255 | 2/20 | 0.37 |
| ▸ | RAB9A | P51151 | 2/20 | 0.37 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.37 |
| ▸ | NPC1 | O15118 | 1/20 | 0.37 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.37 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | LMNA | P02545 | 1/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | CES2 | O00748 | 1/20 | 0.35 |
| ▸ | CES1 | P23141 | 1/20 | 0.35 |
| ▸ | NQO2 | P16083 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29359430 | 1.00 | KMT2A (0.42) | KMT2AF2CTRCMAOBMAPT | |
| SCHEMBL36764 | 1.00 | KMT2A (0.42) | KMT2AF2CTRCMAOBMAPT | |
| SCHEMBL6809982 | 0.87 | POLB (0.38) | KMT2AMAPTSMN1; SMN2MEN1RAB9A | |
| SCHEMBL4350596 | 0.84 | NPC1 (0.42) | KMT2AF2MAOBMAPTMEN1 | |
| SCHEMBL30529837 | 0.84 | NPC1 (0.42) | KMT2AF2MAOBMAPTMEN1 | |
| SCHEMBL4350592 | 0.84 | NPC1 (0.42) | KMT2AF2MAOBMAPTMEN1 | |
| SCHEMBL36510 | 0.83 | HSD11B1 (0.46) | KMT2AMAPTSMN1; SMN2RAB9AKDM4E | |
| SCHEMBL36511 | 0.83 | HSD11B1 (0.46) | KMT2AMAPTSMN1; SMN2RAB9AKDM4E | |
| SCHEMBL5918261 | 0.81 | EP300 (0.45) | F2MAPTKDM4EALDH1A1NQO2 | |
| SCHEMBL5918260 | 0.81 | EP300 (0.45) | F2MAPTKDM4EALDH1A1NQO2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 833 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240053680-A1 | PHOTOSENSITIVE DRY FILM, LAMINATED FILM, METHOD FOR PRODUCING LAMINATED FILM, AND METHOD FOR PRODUCING PATTERNED RESIST FILM | TOKYO OHKA KOGYO CO., LTD. (JP) | 2024-02-15 | — | — | US | disclosed |
| US-11884839-B2 | Acetal-protected silanol group-containing polysiloxane composition | NISSAN CHEMICAL CORPORATION (JP) | 2024-01-30 | — | — | US | disclosed |
| US-11803122-B2 | Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-10-31 | — | — | US | disclosed |
| US-11754926-B2 | Method of forming resist pattern, resist composition and method of producing the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-09-12 | — | — | US | disclosed |
| WO-2023162552-A1 | CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE COMPOSITION, PRODUCTION METHOD FOR SUBSTRATE WITH TEMPLATE, AND PRODUCTION METHOD FOR PLATED ARTICLE | 東京応化工業株式会社 | 2023-08-31 | — | — | WO | disclosed |
| US-20230273521-A1 | CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-08-31 | — | — | US | disclosed |
| WO-2023162551-A1 | METHOD FOR PRODUCING PLATED SHAPED ARTICLE | 東京応化工業株式会社 | 2023-08-31 | — | — | WO | disclosed |
| US-20230229084-A1 | CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2023-07-20 | — | — | US | disclosed |
| US-20230176479-A1 | NEGATIVE RESIST FILM LAMINATE AND PATTERN FORMATION METHOD | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-06-08 | — | — | US | disclosed |
| EP-3702387-B1 | PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE | TOKYO OHKA KOGYO CO LTD (JP) | 2023-05-10 | — | — | EP | disclosed |
| EP-1103856-A1 | Positive resist composition & process for forming resist pattern using same | Central Glass Company, Limited (JP) | 2001-05-30 | — | — | EP | disclosed |
| US-6077644-A | Positive-working resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-06-20 | — | — | US | disclosed |
| US-6063953-A | Chemical-sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-05-16 | — | — | US | disclosed |
| US-6022666-A | Chemical-sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 2000-02-08 | — | — | US | disclosed |
| US-5929271-A | Compounds for use in a positive-working resist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-07-27 | — | — | US | disclosed |
| US-5902713-A | Chemical-sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-05-11 | — | — | US | disclosed |
| EP-0780729-A1 | Chemical-sensitization photoresist composition | TOKYO OHKA KOGYO CO., LTD. (JP) | 1997-06-25 | — | — | EP | disclosed |
| EP-0139609-B1 | PROCESS FOR CURING ACID-CURABLE LACQUERS | CIBA-GEIGY AG (CH) | 1987-02-04 | — | — | EP | disclosed |
| US-4540598-A | LATENT OXIME SULFONATE CATALYSTS | CIBA-GEIGY CORPORATION (US) | 1985-09-10 | — | — | US | disclosed |
| EP-0139609-A1 | Process for curing acid-curable lacquers | CIBA-GEIGY AG (CH) | 1985-05-02 | — | — | EP | disclosed |