SCHEMBL29518652

SCHEMBL29518652

O=C(Nc1ccc(Cl)c(Cl)c1)c1nc2ccccc2[nH]1

nearest known ligand 0.59

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 2/20 0.54
RAB9A P51151 2/20 0.54
GRM4 Q14833 1/20 0.53
MEN1 O00255 2/20 0.53
KMT2A Q03164 2/20 0.53
HTT P42858 1/20 0.53
MAPT P10636 2/20 0.52
KDM4E B2RXH2 1/20 0.52
LMNA P02545 1/20 0.52
SMN1; SMN2 Q16637 1/20 0.52
TDP1 Q9NUW8 1/20 0.52
L3MBTL1 Q9Y468 1/20 0.52
ROCK2 O75116 1/20 0.52
MAOB P27338 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28372308 1.00 NPC1 (0.54) NPC1RAB9AGRM4MEN1KMT2A
SCHEMBL28372986 0.85 RAB9A (0.71) NPC1RAB9AMEN1KMT2AHTT
SCHEMBL4437426 0.82 MMP2 (0.58) NPC1RAB9AMEN1KMT2AMAPT
SCHEMBL29518554 0.82 LMNA (0.64) NPC1RAB9AMEN1KMT2AMAPT
SCHEMBL28372909 0.82 LMNA (0.64) NPC1RAB9AMEN1KMT2AMAPT
SCHEMBL9816236 0.81 FAAH (0.61) NPC1RAB9AMEN1KMT2AMAPT
SCHEMBL14340101 0.81 KCNQ3 (0.57) NPC1RAB9AMEN1KMT2AMAPT
SCHEMBL14516675 0.80 FAAH (0.50) NPC1RAB9AMEN1KMT2AMAPT
SCHEMBL29518293 0.80 FAAH (0.62) NPC1RAB9AMEN1KMT2AMAPT
SCHEMBL28372959 0.80 FAAH (0.62) NPC1RAB9AMEN1KMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115915635-A Circuit board high-compactness protective film surface treatment method and circuit board 盐城市贝加尔电子材料有限公司 2023-04-04 CN claimed
CN-115915635-A Circuit board high-compactness protective film surface treatment method and circuit board 盐城市贝加尔电子材料有限公司 2023-04-04 CN disclosed
CN-110965064-B Application of alkylamide benzimidazole compound, organic weldable protective agent, preparation method, use method and application thereof 深圳市贝加电子材料有限公司 2022-04-29 CN disclosed