Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of Urea. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 6/20 | 0.60 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.60 |
| ▸ | TDP1 | Q9NUW8 | 4/20 | 0.60 |
| ▸ | OR51E2 | Q9H255 | 2/20 | 0.60 |
| ▸ | ACHE | P22303 | 1/20 | 0.55 |
| ▸ | CA2 | P00918 | 2/20 | 0.50 |
| ▸ | CA9 | Q16790 | 2/20 | 0.50 |
| ▸ | CA1 | P00915 | 1/20 | 0.50 |
| ▸ | LDHA | P00338 | 2/20 | 0.46 |
| ▸ | LDHB | P07195 | 1/20 | 0.46 |
| ▸ | TSHR | P16473 | 4/20 | 0.40 |
| ▸ | FGFR4 | P22455 | 1/20 | 0.40 |
| ▸ | BLM | P54132 | 5/20 | 0.39 |
| ▸ | PMP22 | Q01453 | 4/20 | 0.39 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.39 |
| ▸ | CYP3A4 | P08684 | 4/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.33 |
| ▸ | NFKB1 | P19838 | 2/20 | 0.33 |
| ▸ | HPGD | P15428 | 2/20 | 0.33 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Urea SCHEMBL20267806 | 0.91 | ALDH1A1 (0.50) | LMNAALDH1A1TDP1OR51E2ACHE | |
| Urea SCHEMBL27705981 | 0.90 | LMNA (0.60) | LMNAALDH1A1TDP1OR51E2ACHE | |
| Carbamic Acid SCHEMBL5450549 | 0.90 | ACHE (0.70) | LMNAALDH1A1TDP1OR51E2ACHE | |
| Urea SCHEMBL687586 | 0.89 | — | — | |
| Urea SCHEMBL3460099 | 0.89 | LMNA (0.75) | LMNAALDH1A1TDP1OR51E2ACHE | |
| Urea SCHEMBL36685 | 0.89 | — | — | |
| Urea SCHEMBL4454525 | 0.89 | LMNA (0.75) | LMNAALDH1A1TDP1OR51E2ACHE | |
| Urea SCHEMBL347768 | 0.89 | — | — | |
| Carbamic Acid SCHEMBL8987188 | 0.84 | ACHE (0.78) | LMNAALDH1A1TDP1OR51E2ACHE | |
| Carbamic Acid SCHEMBL2472526 | 0.84 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-1802606-B | Resist pattern swelling material, and method for patterning using same | FUJITSU LTD | 2012-12-05 | — | — | CN | disclosed |
| US-7662539-B2 | Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2010-02-16 | — | — | US | disclosed |
| CN-100568094-C | Resist pattern manufacturing process, thickening material therefor, and semiconductor device manufacturing process | FUJITSU LTD (JP) | 2009-12-09 | — | — | CN | disclosed |
| US-7361448-B2 | resist pattern thickening material contains a resin and a polyhydric alcohol; water-soluble or alkali-soluble; using the thickened resist pattern as a mask, a high-quality, high-performance semiconductor device having an extremely fine pattern can be produced | FUJITSU LIMITED (JP) | 2008-04-22 | — | — | US | disclosed |
| CN-1802606-A | Resist pattern swelling material, and method for patterning using same | FUJITSU LTD (JP) | 2006-07-12 | — | — | CN | disclosed |
| EP-1610184-A1 | Resist pattern thickening material and process for forming the same, and semiconductor device and process for manufacturing the same | FUJITSU LIMITED (JP) | 2005-12-28 | — | — | EP | disclosed |
| US-20050277054-A1 | Resist pattern thickening material and process for forming the same, and semiconductor device and process for manufacturing the same | FUJITSU LIMITED (JP) | 2005-12-15 | — | — | US | disclosed |
| CN-1637602-A | Producing technology for non-rusting agent pattern and thickening material thereof and semiconductor device producing technology | FUJITSU LTD (JP) | 2005-07-13 | — | — | CN | disclosed |
| EP-1513013-A2 | Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2005-03-09 | — | — | EP | disclosed |
| US-20050031987-A1 | Resist pattern thickening material, process for forming resist pattern, and process for manufacturing semiconductor device | FUJITSU LIMITED (JP) | 2005-02-10 | — | — | US | disclosed |