SCHEMBL3136958

SCHEMBL3136958

Cc1ccc(S(OS(=O)(=O)C(F)(F)F)(c2ccccc2)c2ccc(C)cc2)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HTT P42858 1/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
GAA P10253 4/20 0.42
BCHE P06276 2/20 0.42
ACHE P22303 2/20 0.42
CA12 O43570 4/20 0.42
CA9 Q16790 4/20 0.42
CA1 P00915 2/20 0.42
CA2 P00918 2/20 0.42
HSD11B1 P28845 1/20 0.41
ALDH1A1 P00352 3/20 0.40
CYP1A2 P05177 2/20 0.40
CYP3A4 P08684 2/20 0.40
KDM4E B2RXH2 1/20 0.40
CYP2D6 P10635 1/20 0.40
CYP2C9 P11712 1/20 0.40
HPGD P15428 1/20 0.40
ALOX12 P18054 1/20 0.40
CYP2C19 P33261 1/20 0.40
GFER P55789 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL36148 1.00 HTT (0.45) HTTSMN1; SMN2GAABCHEACHE
SCHEMBL36225 0.95 GAA (0.45) HTTSMN1; SMN2GAABCHEACHE
SCHEMBL37033 0.89 HTR6 (0.42) HTTSMN1; SMN2CA12CA9CA1
SCHEMBL9135546 0.88 ACHE (0.46) GAABCHEACHEHSD11B1ALDH1A1
SCHEMBL8374963 0.87 BCHE (0.45) HTTGAABCHEACHECA12
SCHEMBL8862179 0.87 ACHE (0.42) HTTGAABCHEACHECA1
SCHEMBL444803 0.86 PTGS2 (0.44) HSD11B1
SCHEMBL1593709 0.86 HSD11B1 (0.40) HTTSMN1; SMN2GAABCHEACHE
SCHEMBL1615718 0.85 CYP1A2 (0.42) SMN1; SMN2HSD11B1ALDH1A1CYP1A2CYP3A4
SCHEMBL219926 0.85 CA1 (0.41) HTTSMN1; SMN2GAABCHEACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12338309-B2 Dielectric film-forming composition FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2025-06-24 US disclosed
US-20240254268-A1 Dielectric Film-Forming Composition FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2024-08-01 US disclosed
US-11945894-B2 Dielectric film-forming composition FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2024-04-02 US disclosed
EP-4176001-A1 DIELECTRIC FILM-FORMING COMPOSITION FUJIFILM Electronic Materials U.S.A, Inc. (US) 2023-05-10 EP disclosed
EP-4118679-A1 METAL DEPOSITION PROCESSES Fujifilm Electronic Materials U.S.A., Inc. (US) 2023-01-18 EP disclosed
WO-2022005783-A1 DIELECTRIC FILM-FORMING COMPOSITION FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2022-01-06 WO disclosed
US-20220002463-A1 Dielectric Film-Forming Composition FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2022-01-06 US disclosed
WO-2021183472-A1 METAL DEPOSITION PROCESSES FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2021-09-16 WO disclosed
US-20210287939-A1 Metal Deposition Processes FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. 2021-09-16 US disclosed
EP-1676835-B1 PROCESS FOR PRODUCING TRIARYLSULFONIUM SALT WAKO PURE CHEM IND LTD (JP) 2014-12-10 EP disclosed
WO-2001022163-A2 RADIATION SENSITIVE COPOLYMERS, PHOTORESIST COMPOSITIONS THEREOF AND DEEP UV BILAYER SYSTEMS THEREOF ARCH SPECIALTY CHEMICALS, INC. (US) 2001-03-29 WO disclosed
US-6165682-A Radiation sensitive copolymers, photoresist compositions thereof and deep UV bilayer systems thereof ARCH SPECIALTY CHEMICALS, INC. (US) 2000-12-26 US disclosed
US-6146793-A TERPOLYMER WITH CHEMICALLY AMPLIFIED (ACID LABILE) MOIETIES AND ORGANOSILICON MOIETIES SUITABLE FOR USE AS THE BINDER RESIN FOR A PHOTOIMAGEABLE RESIST PHOTORESIST COMPOSITION SUITABLE FOR USE IN 193 NM PHOTOLITHOGRAPHIC PROCESSES. ARCH SPECIALTY CHEMICALS, INC. (US) 2000-11-14 US disclosed
EP-0989459-A1 CHEMICALLY AMPLIFIED RESIST COMPOSITION Clariant Finance (BVI) Limited (VG) 2000-03-29 EP disclosed
WO-1999042903-A1 RADIATION SENSITIVE TERPOLYMER, PHOTORESIST COMPOSITIONS THEREOF AND 193 nm BILAYER SYSTEMS OLIN MICROELECTRONIC CHEMICALS, INC. (US) 1999-08-26 WO disclosed
US-5916995-A Acetal-substituted aromatic hydroxy compounds and negative photoresist compositions comprising the same KOREA KUMHO PETROCHEMICAL CO., LTD. (KR) 1999-06-29 US disclosed
US-5852128-A Acid-labile group protected hydroxystyrene polymers or copolymers thereof and their application to radiation sensitive materials CLARIANT AG (CH) 1998-12-22 US disclosed
EP-0827970-A2 New acid-labile group protected hydroxystyrene polymers or copolymers thereof and their application to radiation sensitive materials Clariant AG (CH) 1998-03-11 EP disclosed
EP-0679951-B1 Positive resist composition TOKYO OHKA KOGYO CO LTD (JP) 1997-01-15 EP disclosed
EP-0679951-A1 Positive resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1995-11-02 EP disclosed