SCHEMBL3174085

SCHEMBL3174085

CC(C)(C)c1ccc([I+](OS(=O)(=O)C(C(F)(F)F)(C(F)(F)F)C(F)(F)F)c2ccc(C(C)(C)C)cc2)cc1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.38
CA2 P00918 2/20 0.38
CA9 Q16790 2/20 0.38
ALDH1A1 P00352 6/20 0.37
RORA P35398 1/20 0.35
PDK1 Q15118 1/20 0.33
PDK2 Q15119 1/20 0.33
PDK3 Q15120 1/20 0.33
PDK4 Q16654 1/20 0.33
FFAR1 O14842 1/20 0.33
FFAR4 Q5NUL3 1/20 0.33
MAPT P10636 2/20 0.33
MEN1 O00255 1/20 0.33
CYP1A2 P05177 1/20 0.33
CYP3A4 P08684 1/20 0.33
CYP2C19 P33261 1/20 0.33
KMT2A Q03164 1/20 0.33
NPC1 O15118 1/20 0.33
HPGD P15428 1/20 0.33
MAPK1 P28482 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL36628 0.87 CA1 (0.40) CA1CA2CA9ALDH1A1RORA
SCHEMBL3828157 0.84 CA1 (0.38) CA1CA2CA9ALDH1A1RORA
SCHEMBL114860 0.83 CA1 (0.36) CA1CA2CA9ALDH1A1RORA
SCHEMBL1270050 0.83 HSD11B1 (0.39) CA1CA2CA9ALDH1A1FFAR1
SCHEMBL3762396 0.82 TSHR (0.43) CA1CA2CA9ALDH1A1RORA
SCHEMBL3090902 0.82 CA2 (0.37) CA1CA2CA9ALDH1A1RORA
SCHEMBL448975 0.82 CA2 (0.37) CA1CA2CA9ALDH1A1RORA
SCHEMBL565631 0.80 ALDH1A1 (0.36) CA1CA2CA9ALDH1A1RORA
SCHEMBL1718943 0.78 CA1 (0.43) CA1CA2CA9ALDH1A1MAPT
SCHEMBL503481 0.75 ALDH1A1 (0.42) CA1CA2CA9ALDH1A1RORA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7645556-B2 Composition for forming organic insulating film and method for forming pattern of organic insulating film using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2010-01-12 US disclosed
US-20060006380-A1 Composition for forming organic insulating film and method for forming pattern of organic insulating film using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2006-01-12 US disclosed
US-20050279995-A1 Composition for preparing organic insulating film and organic insulating film prepared from the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2005-12-22 US disclosed