SCHEMBL3203638

SCHEMBL3203638

O=S(=O)(O)c1cc(F)ccc1C(F)(F)F

nearest known ligand 0.38

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
PTGES2 Q9H7Z7 2/20 0.37
KIF11 P52732 4/20 0.37
SLC22A12 Q96S37 3/20 0.36
IDO1 P14902 2/20 0.36
MEN1 O00255 1/20 0.36
KMT2A Q03164 1/20 0.36
PTPN1 P18031 1/20 0.36
FFAR4 Q5NUL3 1/20 0.36
CES2 O00748 1/20 0.35
PTGDR2 Q9Y5Y4 1/20 0.35
GSTO1 P78417 1/20 0.35
MCL1 Q07820 1/20 0.35
EPHX2 P34913 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3206647 0.85 EPHX2 (0.42) PTGES2IDO1PTPN1FFAR4MCL1
Hydrochloric Acid SCHEMBL27308701 0.83 EPHX2 (0.41) PTGES2IDO1PTPN1FFAR4MCL1
SCHEMBL3190051 0.81 CES2 (0.52) SLC22A12MEN1KMT2ACES2
SCHEMBL31296460 0.81 CA12 (0.55) PTGES2KIF11IDO1MEN1KMT2A
SCHEMBL4617448 0.81 TRPV4 (0.47) PTGES2KIF11SLC22A12IDO1MEN1
SCHEMBL5832588 0.79 P2RX1 (0.43) SLC22A12MCL1
SCHEMBL26239548 0.79 SLC22A12 (0.38) PTGES2KIF11SLC22A12MEN1KMT2A
SCHEMBL10590409 0.77 PARP1 (0.41) MEN1KMT2ACES2
SCHEMBL3195282 0.75 PKM (0.47) PTPN1CES2
SCHEMBL247640 0.74 KMT2A (0.56) SLC22A12MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8206888-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2012-06-26 US disclosed
US-20100028800-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2010-02-04 US disclosed
EP-1953593-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2008-08-06 EP disclosed
US-7060414-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2006-06-13 US disclosed
US-20050158657-A1 Radiation-sensitive resin composition SUZUKI AKI (JP) 2005-07-21 US disclosed
US-6899989-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-05-31 US disclosed
US-20020090569-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-07-11 US disclosed