SCHEMBL3204736

SCHEMBL3204736

O=S(=O)(O)c1ccc(C(F)(F)F)cc1F

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PDE2A O00408 3/20 0.43
APP P05067 1/20 0.41
GAA P10253 1/20 0.40
CES2 O00748 2/20 0.39
CA1 P00915 2/20 0.39
CA2 P00918 2/20 0.39
IDO1 P14902 1/20 0.39
MMP1 P03956 1/20 0.39
MMP2 P08253 1/20 0.39
MMP9 P14780 1/20 0.39
MMP8 P22894 1/20 0.39
MMP13 P45452 1/20 0.39
KIF11 P52732 2/20 0.38
DDR1 Q08345 1/20 0.38
CA12 O43570 1/20 0.38
CA9 Q16790 1/20 0.38
MCL1 Q07820 1/20 0.38
GPR27 Q9NS67 1/20 0.37
ALDH1A1 P00352 2/20 0.37
TET2 Q6N021 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL28294245 0.98 PDE2A (0.42) PDE2AAPPGAACES2CA1
SCHEMBL2748203 0.85 ALDH1A1 (0.41) GAACA1CA2CA9ALDH1A1
SCHEMBL3204890 0.85 PDE2A (0.43) PDE2ACES2CA1CA2IDO1
Hydrochloric Acid SCHEMBL28320494 0.83 PDE2A (0.42) PDE2ACES2CA1CA2IDO1
SCHEMBL30014353 0.81 TRPV4 (0.44) PDE2AAPPIDO1KIF11DDR1
SCHEMBL15881879 0.81 TRPV4 (0.44) PDE2AAPPIDO1KIF11DDR1
SCHEMBL795545 0.81 CES2 (0.52) CES2CA1CA2MMP1MMP2
SCHEMBL27855832 0.79 MRGPRX4 (0.47) PDE2ACA1CA2KIF11CA12
SCHEMBL4306864 0.79 ALDH1A1 (0.51) GAACES2CA1CA2MMP1
SCHEMBL14991450 0.78 DDR1 (0.38) CES2CA1CA2IDO1MMP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8206888-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2012-06-26 US disclosed
US-20100028800-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR CORPORATION (JP) 2010-02-04 US disclosed
US-7579131-B2 Positive resist composition and method of forming resist pattern using the same FUJIFILM CORPORATION (JP) 2009-08-25 US disclosed
EP-1953593-A1 RADIATION-SENSITIVE RESIN COMPOSITION JSR Corporation (JP) 2008-08-06 EP disclosed
US-7214467-B2 Photosensitive resin composition FUJIFILM CORPORATION (JP) 2007-05-08 US disclosed
US-7202015-B2 Positive photoresist composition and pattern making method using the same FUJI PHOTO FILM CO., LTD. (JP) 2007-04-10 US disclosed
US-7198880-B2 Positive resist composition FUJIFILM CORPORATION (JP) 2007-04-03 US disclosed
US-7198880-B2 Positive resist composition FUJIFILM CORPORATION (JP) 2007-04-03 US disclosed
US-7163776-B2 Positive-working resist composition FUJI PHOTO FILM CO., LTD. (JP) 2007-01-16 US disclosed
US-7160666-B2 Photosensitive resin composition FUJI PHOTO FILM CO., LTD. (JP) 2007-01-09 US disclosed
US-7060414-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2006-06-13 US disclosed
US-20050158657-A1 Radiation-sensitive resin composition SUZUKI AKI (JP) 2005-07-21 US disclosed
US-6899989-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-05-31 US disclosed
US-20020090569-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-07-11 US disclosed