Known targets — ChEMBL curated mechanism
ABCC9ABL1ACEACHEACVR1ADORA1ADORA2AADORA2BADORA3ADRA1AADRA1BADRA1DADRA2AADRA2BADRA2CADRB1ADRB2ADRB3AGTR1ALOX5ATP4AATP4BBCRBTKCACNA1ACACNA1BCACNA1CCACNA1DCACNA1ECACNA1FCACNA1GCACNA1HCACNA1ICACNA1SCACNA2D1CACNA2D2CACNA2D3CACNA2D4CACNB1CACNB2CACNB3CACNB4CACNG1CACNG2CACNG3CACNG4CACNG5CACNG6CACNG7CACNG8CALCRLCFBCHRM1CHRM2CHRM3CHRM4CHRM5CHRNA1CHRNB1CHRNDCHRNECHRNGCRBNCUL4ACXCR1CXCR2DDB1DDCDHFRDPP4DRD2DRD3DRD4EGFRERBB2ERBB4ESR1ESR2FDPSFKBP1AFLT1FLT3FLT4GARTGHSRGRIA1GRIA2GRIA3GRIA4GRIK1GRIK2GRIK3GRIK4GRIK5GRIN2AGSK3AGSK3BHDAC1HDAC10HDAC11HDAC2HDAC3HDAC4HDAC5HDAC6HDAC7HDAC8HDAC9HRH1HTR1AHTR1BHTR1DHTR1EHTR1FHTR2AHTR2BHTR2CHTR3AHTR3BHTR3CHTR3DHTR3EHTR4HTR5AHTR6HTR7IDH1IDH2IMPA1ITGA2BITGB3JAK1JAK2JAK3KCNJ11KCNK3KCNK9KDRKITMEN1METMMP1MMP13MMP7MMP8NANOD2NS5bODC1OPG057OPRD1OPRK1OPRM1PPARP1PARP2PDE3APDE3BPDE4APDE4BPDE4CPDE4DPDGFRBPIK3CAPIK3CBPIK3CDPIK3CGPIK3R1PIK3R2PIK3R3PIK3R5PKLRPPARDPPATPTGS1PTGS2RBX1ROCK1ROCK2RRM1RRM2RRM2BSCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASCNN1ASCNN1BSCNN1GSIGMAR1SLC10A2SLC5A2SLC6A2SLC6A3SLC6A4SLC9A3SYKTACR1THRATHRBTOP1TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYK2TYMSVDRampCblablaT-3blaT-4blaT-5blaT-6blaUOE-1dacAdacBdacCfolAfolPftsIgyrAgyrBileSmecAmrcAmrcBmrdAparCparEpbp2pbp4pbpApbpFrplArplBrplCrplDrplErplFrplIrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmE2rpmFrpmGrpmG1rpmG2rpmG3rpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUthyAykgMykgO
The experimentally established mechanism targets of Methylamine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methylamine SCHEMBL5492498 | 1.00 | — | — | |
| Methylamine SCHEMBL72802 | 1.00 | — | — | |
| Methylamine SCHEMBL2341548 | 1.00 | — | — | |
| Methylamine SCHEMBL8644698 | 1.00 | — | — | |
| Methylamine SCHEMBL9853401 | 1.00 | — | — | |
| Methylamine SCHEMBL6387661 | 0.89 | — | — | |
| Methylamine SCHEMBL313813 | 0.89 | — | — | |
| Methylamine SCHEMBL6387652 | 0.89 | — | — | |
| Methylamine SCHEMBL15741462 | 0.89 | — | — | |
| Methylamine SCHEMBL4335369 | 0.89 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1215305-B1 | Method for preparing an electroplating bath and related copper plating process | IMEC (BE) | 2010-05-05 | — | — | EP | disclosed |
| US-20060216872-A1 | Method of manufacturing a semiconductor device having an organic thin film transistor | HITACHI, LTD. (JP) | 2006-09-28 | — | — | US | disclosed |
| US-6872295-B2 | Method for preparing an electroplating bath and related copper plating process | INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC) (BE) | 2005-03-29 | — | — | US | disclosed |
| EP-1022355-B1 | Deposition of copper on an activated surface of a substrate | IMEC INTERUNIVERSITY MICROELEC (BE) | 2004-09-15 | — | — | EP | disclosed |
| US-20040096757-A1 | Photosensitive resin compositon, photosesitive resist for color filter, and process for producing color filter | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2004-05-20 | — | — | US | disclosed |
| US-6585811-B2 | Method for depositing copper or a copper alloy | IMEC VZW (BE) | 2003-07-01 | — | — | US | disclosed |
| US-20020153259-A1 | Method for preparing an electroplating bath and related copper plating process | INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM (IMEC) (BE) | 2002-10-24 | — | — | US | disclosed |
| US-20020127348-A1 | Method for depositing copper or a copper alloy | IMEC VZW (BE) | 2002-09-12 | — | — | US | disclosed |
| EP-1215305-A1 | Method for preparing an electroplating bath and related copper plating process | INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM VZW (BE) | 2002-06-19 | — | — | EP | disclosed |
| US-6398855-B1 | Method for depositing copper or a copper alloy | IMEC VZW (BE) | 2002-06-04 | — | — | US | disclosed |
| EP-1022355-A2 | Deposition of copper on an activated surface of a substrate | Imec (Interuniversity Microelectronics Center) VZW (BE) | 2000-07-26 | — | — | EP | disclosed |
| EP-1020543-A1 | Deposition of copper on an activated surface of a substrate | INTERUNIVERSITAIR MICRO-ELEKTRONICA CENTRUM VZW (BE) | 2000-07-19 | — | — | EP | disclosed |
| EP-0553737-B1 | Radiation-sensitive composition | BASF AG (DE) | 1999-09-22 | — | — | EP | disclosed |
| US-5759750-A | Radiation-sensitive mixture | BASF AKTIENGESELLSCHAFT (DE) | 1998-06-02 | — | — | US | disclosed |
| EP-0553737-A1 | Radiation-sensitive composition | BASF Aktiengesellschaft (DE) | 1993-08-04 | — | — | EP | disclosed |