SCHEMBL3273262

SCHEMBL3273262

N#COCC1CCCC(COC#N)C1

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
CTSL P07711 1/20 0.34
CTSB P07858 1/20 0.34
CTSK P43235 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL23130548 0.95 CTSL (0.38) CTSLCTSBCTSK
SCHEMBL22899073 0.94 CTSL (0.32) CTSLCTSBCTSK
SCHEMBL20458642 0.90 CTSL (0.30) CTSLCTSBCTSK
SCHEMBL18467685 0.90 CTSL (0.30) CTSLCTSBCTSK
SCHEMBL17299362 0.90 CTSL (0.30) CTSLCTSBCTSK
SCHEMBL21180208 0.86 CTSL (0.30) CTSLCTSBCTSK
SCHEMBL23005625 0.85
SCHEMBL24404216 0.85
SCHEMBL2336763 0.83 CTSK (0.48) CTSLCTSBCTSK
SCHEMBL21424834 0.82 CTSK (0.34) CTSK

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7691959-B1 Moisture curable silicone hot melt HENKEL CORPORATION (US) 2010-04-06 US claimed
US-7625978-B1 Moisture curable silicone urea hot melt reinforced by organic polymers HENKEL CORPORATION (US) 2009-12-01 US claimed
WO-2006028927-A1 SILICONE-CONTAINING HOT-MELT COMPOSITIONS HENKEL CORPORATION (US) 2006-03-16 WO claimed
WO-2024144255-A1 ACID OR MOISTURE REDUCING AGENT FOR NON-AQUEOUS ELECTROLYTE, NON-AQUEOUS ELECTROLYTE COMPRISING SAME, LITHIUM SECONDARY BATTERY CONTAINING NON-AQUEOUS ELECTROLYTE, AND METHOD FOR REDUCING ACID OR MOISTURE IN NON-AQUEOUS ELECTROLYTE 주식회사 엘지에너지솔루션 2024-07-04 WO disclosed
US-11839700-B2 Bio-electrode composition, bio-electrode, and method for manufacturing a bio-electrode SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-12-12 US disclosed
US-11731936-B2 Diisocyanate composition, preparation method thereof and optical material using same SKC CO., LTD. (KR) 2023-08-22 US disclosed
US-11634383-B2 Method of preparing diisocyanate composition SKC CO., LTD. (KR) 2023-04-25 US disclosed
EP-2949676-B1 NON-HOT-MELT MDI-BASED POLYURETHANE COMPOSITION BEARING NCO END GROUPS AND HAVING A LOW CONTENT OF MDI MONOMER, COMPRISING AT LEAST ONE ISOCYANATE COMPOUND OF PARTICULAR MOLAR VOLUME BOSTIK SA (FR) 2023-02-22 EP disclosed
US-11572432-B2 Polythiourethane-based plastic lens SKC CO., LTD. (KR) 2023-02-07 US disclosed
US-20220234998-A1 METHOD OF PREPARING DIISOCYANATE COMPOSITION SKC CO., LTD. 2022-07-28 US disclosed
US-20220209300-A1 NON-AQUEOUS ELECTROLYTE SOLUTION, AND NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY MITSUBISHI CHEMICAL CORPORATION (JP) 2022-06-30 US disclosed
EP-3128596-A1 NON-AQUEOUS ELECTROLYTIC SOLUTION, AND NON-AQUEOUS ELECTROLYTE SECONDARY CELL USING SAME Mitsubishi Chemical Corporation (JP) 2017-02-08 EP disclosed
US-20170018805-A1 NON-AQUEOUS ELECTROLYTIC SOLUTION AND NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY USING THE SAME MITSUBISHI CHEMICAL CORPORATION (JP) 2017-01-19 US disclosed
EP-2677009-B1 HARD-COAT COMPOSITION FOR METAL SUBSTRATE, AND MOLDED ARTICLE FUJIKURA KASEI KK (JP) 2016-09-14 EP disclosed
US-9012023-B2 Hard coat coating composition for metal base material and molded product FUJIKURA KASEI CO., LTD. (JP) 2015-04-21 US disclosed
EP-2677009-A1 HARD-COAT COMPOSITION FOR METAL SUBSTRATE, AND MOLDED ARTICLE Fujikura Kasei Co., Ltd. (JP) 2013-12-25 EP disclosed
US-20130309510-A1 HARD COAT COATING COMPOSITION FOR METAL BASE MATERIAL AND MOLDED PRODUCT FUJIKURA KASEI CO., LTD. (JP) 2013-11-21 US disclosed
US-7625978-B1 Moisture curable silicone urea hot melt reinforced by organic polymers HENKEL CORPORATION (US) 2009-12-01 US disclosed
US-20080241407-A1 Silicone-Containing Hot-Melt Compositions CHU HSIEN-KUN 2008-10-02 US disclosed
WO-2006028927-A1 SILICONE-CONTAINING HOT-MELT COMPOSITIONS HENKEL CORPORATION (US) 2006-03-16 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11634383-B2 Method of preparing diisocyanate composition INCENP, CENPE, CRYAA CTSL 4541/4885CTSB 4345/4885CTSK 4104/4885
US-20220209300-A1 NON-AQUEOUS ELECTROLYTE SOLUTION, AND NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY NONO, POF1B, VDAC1 CTSL 4182/4885CTSB 3033/4885CTSK 3517/4885
US-11731936-B2 Diisocyanate composition, preparation method thereof and optical material using same SMO, GCG, INCENP CTSL 4194/4885CTSB 4785/4885CTSK 3956/4885
US-20220234998-A1 METHOD OF PREPARING DIISOCYANATE COMPOSITION INCENP, CENPE, SMO CTSL 4772/4885CTSB 4714/4885CTSK 4536/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.